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Hot-melt adhesive

A hot-melt adhesive and adhesive technology, applied in the direction of adhesives, adhesive types, polymer adhesive additives, etc., can solve the problems of poor fluidity, heavy labor, long-term storage, difficult transportation, etc. Achieve the effects of excellent adhesion, excellent blocking resistance, and excellent storage stability

Inactive Publication Date: 2016-06-01
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, hot-melt adhesives sometimes cause strong adhesion of particles to each other due to the manufacturing process, subsequent storage, transportation, etc.
In addition, since its fluidity is extremely poor, there is a problem that it takes a lot of labor to pulverize the sticky hot-melt adhesive during production and packaging.
Therefore, long-term storage, transportation, etc. are also difficult.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6、 comparative example 1～4

[0069] According to the composition shown in Table 1, a hot-melt adhesive was prepared. The compounding unit in the table is mass %.

[0070] The ethylene-vinyl acetate copolymer (EVA) used in the study was Ultrathene 722 (trade name manufactured by Tosoh Corporation, vinyl acetate (VA) content of 28% by mass, melt flow rate (MFR) = 400, Universal Softening point 82° C.) and Ultrathene 735 (trade name manufactured by Tosoh Corporation, VA content 28% by mass, melt flow rate (MFR) = 1000, softening point 85° C. ring and ball method).

[0071] As the olefin resin, TAFMERP0480 (trade name, ethylene-propylene-based α-olefin copolymer resin manufactured by Mitsui Chemicals, Inc.) was used.

[0072] As the tackifying resin, ARKONP100 (trade name manufactured by Arakawa Chemical Industry Co., Ltd., hydrogenated C9 petroleum resin, softening point 100° C.) and ARKONP125 (trade name manufactured by Arakawa Chemical Industry Co., Ltd., hydrogenated C9 petroleum resin) were used. , sof...

Embodiment 7～10、 comparative example 5～8

[0105] According to the compounding shown in Table 3, it carried out similarly to Example 1 etc., and produced the spherical hot-melt-adhesive. The compounding unit in Table 3 is mass %.

[0106] As the olefin resin, RT2585A (trade name manufactured by REXTAC, LLC, ethylene-propylene-based α-olefin copolymer resin) was used. As other components, the same materials as in Example 1 and the like were used.

[0107] table 3

[0108]

[0109] About the obtained hot-melt adhesive, the softening point, blocking resistance, and Shore hardness were evaluated. Shore hardness was evaluated by the method shown below. Other evaluations were performed by the same methods as in Example 1 and the like. The results are shown in Table 4.

[0110] Shore hardness

[0111] The Shore hardness at 23° C. of each hot-melt adhesive was measured in accordance with JISA Shore hardness.

[0112] Table 4

[0113]

[0114] **Because polypropylene wax does not mix with surfactants, cover materi...

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Abstract

Disclosed is a hot-melt adhesive having a molded product of an adhesive composition, and a coating material that is adhered to the surface of the molded product. The adhesive composition includes an ethylene-vinyl acetate copolymer, a tackifying resin, and a wax. The coating material includes an anionic surfactant and a polyethylene wax.

Description

technical field [0001] This invention relates to hot melt adhesives. Background technique [0002] Use a dedicated coating machine to heat and melt the hot-melt adhesive and apply it on the adherend. After the adherend is pasted, the adhesive is cooled and solidified, so that initial bonding can be obtained in a short time. Since the hot-melt adhesive does not contain an organic solvent or the like and is applied by heating and melting, it does not require a drying solvent and has excellent initial adhesiveness compared to an adhesive that is diluted and applied with an organic solvent or the like. Since it is easy to automate coating and bonding using a large applicator, hot melt adhesives are mainly used in assembly lines such as packaging, woodworking, plywood, bookbinding, and can making. [0003] Hot melt adhesives are widely used in packaging, bookbinding, plywood, woodworking and other fields. The use of hot melt adhesives is increasing year by year due to the short...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/08C09J11/08C09J131/04
CPCC09J11/08C09J123/08C09J131/04
Inventor 桑原纪子清水哲也
Owner RESONAC CORPORATION
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