Shielding support structure for improving stress of main board chip, and mobile terminal

Abstract

The invention discloses a shielding support structure for improving the stress of a main board chip. The shielding support structure comprises a PCB board, a chip, a shielding support and a shielding cover. The chip is welded to one surface of the PCB board. The shielding support is welded to the other surface of the PCB board. The layout projection area of the chip is superposed with the shielding support. Side wall welding pins, which are welded to the surface of the PCB board, of the shielding support stretch across the chip. A sunk bench concave towards the PCB direction is formed on the side edge area, superposed with the layout projection area of the chip, on the top surface of the shielding support in a punch forming manner. The shielding cover covers the shielding support. An interval is formed between the sunk bench and the shielding cover. The contact area of the top surface of the shielding support with the shielding cover forms a support surface. According to the invention, the impact force conducted to the chip is effectively reduced through the side wall welding pins when a terminal falls off, the failure probability of the chip is substantially reduced, the structure is simple, and the manufacturing cost is low.

Description

technical field [0001] The present invention relates to the technical field of parts and components of mobile terminals, and more particularly, to a shielding bracket structure and a mobile terminal for improving the stress of a motherboard chip. Background technique [0002] In order to improve user experience, the thickness of mobile terminals such as mobile phones is getting thinner and thinner. In the process of user use, the mobile phone often directly impacts the internal chip (BB chip, storage chip, etc.) of the mobile phone due to the drop event, which may easily lead to the failure of the chip, and then cause the mobile phone to fail to be used normally or be scrapped. [0003] Specifically, the hardware layout of a mobile phone usually has multiple modules, and each module is surrounded by a corresponding shielding bracket and a shielding cover to achieve a shielding effect. Due to the large size of some chips inside the mobile phone, on the backside of the PCB bo...

AI Technical Summary

Problems solved by technology

When the external impact force acts on the mobile phone, the side wall soldering feet of the shielding bracket bear most of the external impact, and the side wall soldering legs of the shielding bracket straddle the back of the large chip, so the impact force will be transmitted to the large chip on the back accordingly On the other hand, if the impact force is too large, the chip will be severely deformed, resulting in chip failure

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