Fingerprint module manufacturing method

A fingerprint module and manufacturing method technology, applied in character and pattern recognition, instruments, electrical digital data processing and other directions, can solve the problems of glue overflow, low precision, low water glue efficiency, etc., and achieve the effect of uniform printing

Inactive Publication Date: 2016-06-15
TOP TOUCH ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a fingerprint module, which aims to solve the problems of low efficiency, low precision and glue overflow in the prior art when water glue is used for bonding.

Method used

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  • Fingerprint module manufacturing method
  • Fingerprint module manufacturing method

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Embodiment Construction

[0027] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] figure 1 Is a schematic flow chart of a fingerprint module manufacturing method according to an embodiment of the present invention, figure 2 It is a schematic diagram of the structure of a fingerprint film set provided by an embodiment of the present invention. figure 1 , 2 , An embodiment of the present invention provides a method for manufacturing a fingerprint module, including the following steps:

[0029] Step S101, bonding the sensor chip 1 and the flexible circuit board 2 to form a first module.

[0030] Specifically, in the embodiment of the present invention, a reflow soldering process is used to bond the sensor chip 1 and the flexible circuit board 2 to form the first module. The preferred peak temperature of reflow solderin...

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Abstract

The invention relates to the technical field, and specifically relates to a fingerprint module manufacturing method. The fingerprint module manufacturing method includes the steps: attaching an induction chip to a flexible printed circuit board so that a first module is formed; printing glue on the surface of the first module to form a second module; and attaching the second module to a cover plate to form a fingerprint module. During the process of the fingerprint module manufacturing method, a screen printing plate with hollow areas is introduced so that the glue is not overflowed and the glue can be uniformly printed on the induction chip when the glue is printed.

Description

Technical field [0001] The invention relates to the technical field of touch screens, in particular to a method for manufacturing a fingerprint module. Background technique [0002] In recent years, in the field of touch screen technology, because fingerprint recognition has the advantages of high uniqueness, high stability, high accuracy, high security, high collectability, and low cost, fingerprint recognition has been selected by “selection” on touch display devices. "Configuration" will become "standard configuration". With the rise of online payment, mobile payment and other means, higher requirements are put forward for information security. The use of the feature of "fingerprint uniqueness" for information protection has both high security and good operability. Fingerprint identification system will become the best choice to protect information security. The application of fingerprint module is not limited to mobile terminal devices, but can also be applied to smart home...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06F3/041
CPCG06F3/0412G06F2203/04103G06V40/13
Inventor 李喜荣毛肖林曾海滨洪晨耀王春桥梁伟业
Owner TOP TOUCH ELECTRONICS
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