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Tape for wafer processing

A wafer processing and release film technology, applied in the direction of film/sheet adhesives, electrical components, adhesives, etc., can solve the problems of poor, poor adhesion between the adhesive layer and the semiconductor wafer, etc., to reduce the effect of label marks

Active Publication Date: 2018-10-09
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then, if a transfer mark occurs, there is a possibility that a problem may occur during the processing of the wafer due to poor adhesion between the adhesive layer and the semiconductor wafer.

Method used

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  • Tape for wafer processing
  • Tape for wafer processing
  • Tape for wafer processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] The release film 2A formed with the adhesive layer 3A after refrigerated storage was returned to normal temperature, and the adhesive layer was pre-cut circularly with a diameter of 220 mm by adjusting the depth of incision into the release film to be 10 μm or less. Thereafter, unnecessary portions of the adhesive layer were removed, and the release film 2A was laminated at room temperature so that the adhesive layer of the adhesive film 1A was in contact with the adhesive layer. Then, about the adhesive film 1A, the circular pre-cut processing of diameter 290mm was performed concentrically with the adhesive bond layer so that the incision depth to the release film may be 10 micrometers or less. Next, the support member 4A was attached to the second surface of the release film 2A opposite to the first surface on which the adhesive layer and the adhesive film were provided, and at the center of the release film 2A in the lateral direction, to produce a figure 2 Wafer pr...

Embodiment 2

[0097] (Example 2) Except having used the support member 4B instead of 4 A of support members, it carried out similarly to Example 1, and produced the tape for wafer processing of Example 2.

Embodiment 3

[0099] Except having used the adhesive bond layer 3B instead of the adhesive bond layer 3A, it carried out similarly to Example 1, and produced the tape for wafer processing of Example 3.

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Abstract

An objective of the present invention is to provide a wafer processing tape which can reduce generation of a label stain, select a support member irrespective of a thickness of an adhesive layer, and reduce introduction of air between the adhesive layer and an adhesive film. The wafer processing tape is characterized in comprising: a lengthy releasing film (11); an adhesive layer (12) which has a predetermined planar shape and formed on a first surface of the releasing film (11); a label portion (13a) which has a predetermined planar shape, covers the adhesive layer (12), and is installed to touch the releasing film (11) around the adhesive layer (12); an adhesive film (13) which has a peripheral portion (13b) which surrounds an exterior of the label portion (13a); and a support member (14) which is formed on a second surface opposite to the first surface of the releasing film (11) and includes a portion corresponding to the adhesive layer (12), wherein the support member (14) is installed along a long direction of the releasing film (11) within an area which do not include a portion corresponding to an end portion in a short direction of the releasing film (11) of the label portion (13a).

Description

technical field [0001] The present invention relates to a tape for wafer processing, and particularly relates to a tape for wafer processing having two functions of a die dicing tape and a die-bonding film. Background technique [0002] Recently, a die dicing-die-bonding tape is being developed, which has both a die dicing tape for fixing the semiconductor wafer when cutting and separating the semiconductor wafer into individual chips (die dicing), and a die bonding tape for bonding the cut semiconductor chips. Two functions of a die-bonding film (also called a die-attach film) used for laminating and bonding semiconductor chips to each other in a lead frame, package substrate, etc., or in a stack package. [0003] As such a die-dicing-die-bonding tape, a pre-dicing process may be performed in consideration of handling properties such as attachment to a wafer, mounting to a die-bonding ring frame during die dicing, and the like. [0004] exist Figure 4 and Figure 5 An ex...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/20H01L21/683
CPCC09J7/20C09J2203/326H01L21/6836
Inventor 杉山二朗青山真沙美佐久间登大田乡史木村和宽
Owner FURUKAWA ELECTRIC CO LTD