Method for detecting heat resistance of hot melt adhesive for sealing

Abstract

The invention relates to a method for detecting heat resistance of a hot melt adhesive for sealing, comprising the steps: 1), setting a heat resistance temperature standard for the hot melt adhesive to conform to actual highest transport and storage ambient temperature, and continuously increasing the temperature and holding the temperature for 2 h to simulate an actual ambient temperature rise process and to measure accurate heat resistance temperature; 2), setting each peeling and cutting direction and weight of a counterweight used in this direction to simulate stress conditions of the actual transport and storage process; 3), setting the size and shape of each cardboard and the position and usage of the hot melt adhesive to be sprayed, ensuring conformity to actual stress, and ensuring testing accuracy. The method for detecting the heat resistance of the hot melt adhesive is standardized herein, and it is possible to monitor quality performance of the hot melt adhesive more stably, ensure product sealing quality and solve the quality problems of product adhesive failure and loosening due to high temperature in summer.

Description

Technical field [0001] The invention relates to a hot melt adhesive, in particular to a method for detecting the heat resistance of the hot melt adhesive for sealing boxes. Background technique [0002] Hot melt adhesives for sealing boxes are generally based on thermoplastic polymers, which are prone to creep and have certain limitations in heat resistance. In the past use process, the hot-melt adhesive seal product with poor heat resistance appears to be loose after being transported and stored for a period of time, especially in the case of high ambient temperature, and there is no better inspection method for incoming goods. , Such as the occurrence of mass carton bulk packaging quality accidents, it will have a great impact on product quality. [0003] The original testing method and standard for thermal resistance of hot melt adhesive is to store at 45°C for 3 days. The sealant will not break after tearing, and more than 70% can break the paper. However, the actual applicat...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a new method for detecting the heat resistance of hot-melt adhesives for box sealing, which can more stably monitor the quality and performance of hot-melt adhesives, ensure the quality of finished product sealing, and solve the problem of unpacking of finished products due to high temperature in summer. Quality issues

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