Cooling system and electronic equipment

Abstract

The invention provides a cooling system, which comprises a host, a first cooling unit, a second cooling unit and a bracket, wherein the host comprises a processing unit which is configured to generate heat under a working state; the first cooling unit is in contact with the processing unit, adsorbs at least one part of heat from the processing unit, and transfers the adsorbed heat to the second cooling unit; the second cooling unit is in contact with the first cooling unit and forms at least one part of the back shell of the host, and the second cooling unit adsorbs the heat from the first cooling unit and distributes the adsorbed heat on the second cooling unit; and the bracket comprises a shell, at least one part of the shell is in contact with the host through the second cooling unit if the host is put on the bracket in a preset way, and the part, which is in contact with the second cooling unit, of the shell adsorbs the heat from the second cooling unit and transfers the heat to outside.

Description

technical field [0001] The disclosure designs a heat dissipation system and electronic equipment, and in particular relates to a heat dissipation system and electronic equipment capable of improving CPU performance and preventing the CPU from overheating. Background technique [0002] At present, with the widespread popularization of electronic products such as smart phones and tablet computers and the increasing dependence of users on such electronic products, the performance requirements of users for such electronic products, especially the performance requirements of processors, are also gradually increasing. Causes an increase in heat generation of components such as the CPU. However, due to restrictions on weight, thickness, size, battery life, etc., such electronic products are usually not equipped with a built-in fan to cool the CPU. Therefore, in order to avoid overheating of the CPU, the performance of the CPU is usually set according to the worst heat dissipation ...

AI Technical Summary

Problems solved by technology

[0002] At present, with the widespread popularization of electronic products such as smart phones and tablet computers and the increasing dependence of users on such electronic products, the performance requirements of users for such electronic products, especially the performance requirements of processors, are also gradually increasing. Causes an increase in heat generation of components such as the CPU

However, due to limitations in weight, thickness, size, battery life, etc., such electronic products are usually not equipped with a built-in fan to cool the CPU

Therefore, in order to avoid overheating of the CPU, the performance of the CPU is usually set according to the worst heat dissipation conditions, which not only limits the improvement of CPU performance, but also usually only can set a single power consumption mode for the CPU, that is, the power consumption under the worst heat dissipation conditions model

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