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Substrate transfer method for vacuum processing equipment

A technology of processing equipment and transmission method, which is applied in the direction of conveyor objects, transportation and packaging, etc., can solve the problems of waste of resources and low yield, and achieve the effect of improving production capacity and saving time.

Inactive Publication Date: 2016-07-13
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Assuming that two product sheets a and b are to be processed, the related technology adopts figure 2 The workflow shown is a complete serial method. During the process of inflating and pumping the cassette chamber, the process chamber is in an unproduction state, resulting in low yield and waste of resources, which needs to be improved.

Method used

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  • Substrate transfer method for vacuum processing equipment
  • Substrate transfer method for vacuum processing equipment
  • Substrate transfer method for vacuum processing equipment

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Embodiment Construction

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0022] image 3 It is a flow chart of a substrate transfer method for vacuum processing equipment according to an embodiment of the present invention. Vacuum processing equipment includes a cassette chamber, a transfer chamber and a process chamber, wherein the cassette chamber includes a number of preparatory wafer positions and finished wafer positions, and the transfer chamber and process chamber need to maintain a vacuum state. refer to image 3 As shown, the substrate transfer method comprises the following steps:

[0023...

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Abstract

The invention discloses a substrate transfer method for vacuum processing equipment. The vacuum processing equipment comprises a substrate box chamber, a transfer chamber and a process chamber. A plurality of substrate preparation positions and a plurality of substrate completion positions are arranged inside the substrate box chamber. The transfer chamber and the process chamber are kept in the vacuum state. The substrate transfer method is designed based on the idea of parallel tasks. When a first input product substrate is processed in the process chamber, a second input product substrate is delivered into the substrate box chamber for preparation. Therefore, the time spent on the vacuum-pumping operation / air-inflation operation of the substrate box chamber can be saved. Meanwhile, the productivity of the vacuum processing equipment per unit time is improved.

Description

technical field [0001] The invention relates to the field of microelectronic processing and manufacturing, in particular to a method for transferring substrates used in vacuum processing equipment. Background technique [0002] Yield (also known as capacity, throughput) is an important indicator in the process of process automation manufacturing, which directly affects production and company benefits. In the field of microelectronics processing and manufacturing, the yield is determined by many factors, two of which are process time and transfer time. The process time refers to the time for the product piece to be processed in the process chamber, which is mainly determined by the hardware of the machine. The transmission time refers to the time it takes for the product piece to travel from the cassette chamber to the process chamber, which is mainly determined by the transmission structure and transmission rate. [0003] related technologies, such as figure 1 As shown, t...

Claims

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Application Information

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IPC IPC(8): H01L21/677
Inventor 马平潘宇涵
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD