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Compound grinding machine and grinding method

A compound grinding and workpiece technology, applied in the direction of grinding machines, grinding bed, grinding machine parts, etc., can solve the problem of reduced precision

Active Publication Date: 2019-08-27
JTEKT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When grinding each process while sequentially transferring the workpiece between multiple grinding machines, since the workpiece is mounted and removed in each process, the holding position of the workpiece is different for each process, which may reduce the accuracy

Method used

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  • Compound grinding machine and grinding method
  • Compound grinding machine and grinding method
  • Compound grinding machine and grinding method

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Embodiment Construction

[0029] The above and other features and advantages of the present invention will become more apparent from the following description of embodiments with reference to the accompanying drawings, in which like elements are given like numerals.

[0030] Hereinafter, embodiments of the present invention will be described based on a compound grinding machine that grinds an outer ring of a bearing as a workpiece.

[0031] Such as figure 1 As shown, the compound grinding machine 1 includes a bed 2, and on the bed 2, a rotary table 5 rotatable about a vertical C-axis (rotation axis) is provided. In addition, the bed 2 is provided with a column 3a capable of reciprocating in the direction of the Xa axis, a column 3b capable of reciprocating in the direction of the Xb axis, and a column 3c capable of reciprocating in the direction of the Xc axis, which are perpendicular to and horizontal to the C axis. The side surfaces of each column are provided with a grinding wheel head 4a capable o...

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PUM

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Abstract

The invention relates to a composite grinder and a grinding method. The composite grinder is provided with work piece retaining devices (61, 62, 63, 64) on a circle around a rotation axis of a rotary work table (5). The composite grinder is provided with stand columns (3a, 3b, 3c) moving forward and backward along a direction orthogonal to the rotation axis; a sand wheel base (4a, 4b, 4c) arranged on the stand colume and moving forward and backward along a direction parallel to the rotation axis; and sand wheels (9a, 9b) arranged on the sand wheel bases and rotating around sand wheel shafts parallel to the rotation axis. Through the rotation of the work table (5), work pieces (W) whose end faces are retained on the work piece retaining device are moved successively in a manner than the center of the grounding part and the center of the working main shaft are consistant and a plurality of grinding working procedures are performed for grinding the inner peripheral face and the outer peripheral face.

Description

technical field [0001] The present invention relates to a compound grinding machine and a grinding method for holding a plurality of workpieces on a rotary table and advancing a process with a plurality of grinding wheels every time the rotary table rotates to grind the workpieces. Background technique [0002] In the case of grinding a workpiece having a grinding portion of a rotating surface in a plurality of steps, the workpiece is ground while being sequentially transferred between a plurality of grinding machines. [0003] In addition, in planar polishing of wafers, there is a technique that includes a rotary table holding a plurality of wafers on its upper surface, and a plurality of polishing devices arranged to face the rotary table, and sequentially feeds wafers by rotation of the rotary table. , and use each grinder to process the specified process. Refer to Japanese Unexamined Patent Publication No. 2012-240186. [0004] When performing grinding in each process ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/00B24B41/06B24B41/00B24B51/00B24B41/02
Inventor 赖经昌史安藤善昭竹岛雅之小林久修近藤隆
Owner JTEKT CORP