Heating element structure for glue discharging and sintering combined furnace for sintering electronic elements

Abstract

The invention provides a heating element structure for a glue discharging and sintering combined furnace for sintering electronic elements. Heating elements are arranged in an inlet zone, a transition zone, a sintering molding zone and a heat preservation outlet zone of a whole hearth, consumption of energy resources is reduced while material sintering is guaranteed, and energy conservation and environment protection are guaranteed. The heating element structure comprises the sintering hearth, the interior of the sintering hearth is provided with four heating zones including the inlet zone, the transition zone, the sintering molding zone and the heat preservation outlet zone from an inlet to an outlet, the resistance wire heating elements are arranged on the side wall of the inlet zone, and the interiors of the resistance wire heating elements extend to a zone where the sintering hearth is located; the side wall of the transition zone and the side wall of the heat preservation outlet zone are each provided with the silicon carbide rod heating elements, and the heat ends of the silicon carbide rod heating elements are located in the zone where the sintering hearth is located; and the silicon molybdenum rod heating elements are installed at the top of the sintering molding zone in an inserted manner, and the bottoms of the silicon molybdenum rod heating elements are located on the inner sides of the two side walls of the sintering hearth.

Description

technical field [0001] The invention relates to the technical field of sintering furnaces for electronic components, in particular to a heating element structure for a combined debinding and sintering furnace for sintering electronic components. Background technique [0002] The sintering of existing electronic components is all sintered in a sintering furnace. The sintering furnace includes a debinding area and a sintering area. Since the existing sintering area and the debinding area are arranged in a straight line, the length of the entire furnace body is very long. long, which is not conducive to the reasonable arrangement of equipment. Therefore, a debinding and sintering combined furnace for sintering electronic components of the sintering furnace is designed as a replacement structure for the existing sintering furnace. The sintering area of ​​the existing sintering furnace is a single Heating source, which makes the temperature of the entire sintering area a relative...

AI Technical Summary

Problems solved by technology

[0002] The sintering of existing electronic components is all sintered in a sintering furnace. The sintering furnace includes a debinding area and a sintering area. Since the existing sintering area and the debinding area are arranged in a straight line, the length of the entire furnace body is very long. long, which is not conducive to the reasonable arrangement of equipment. Therefore, a debinding and sintering combined furnace for sintering electronic components of the sintering furnace is designed as a replacement structure for the existing sintering furnace. The sintering area of ​​the existing sintering furnace is a single Heating source, which makes the temperature of the entire sintering area a relatively high temperature. However, in the actual sintering process, the material is accompanied by the track of the sintering area, and the required temperature is not a constant temperature environment. The existing sintering furnace is for To ensure the sintering temperature inside the entire sintering area, all of them are equipped with high-temperature heating elements, which makes the energy utilization rate of the entire sintering low, which is not conducive to energy saving and environmental protection

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