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Pre-laminating process for inner-layer core plate of thick-copper multilayer PCB

A technology of inner core board and PCB board, which is applied in multi-layer circuit manufacturing, electrical components, printed circuit manufacturing, etc. It can solve the problems of insufficient glue filling, unchanged processing technology, and difficulty in resin filling in copper-free areas. achieve high efficiency

Inactive Publication Date: 2016-07-20
HUANGSHI HUSHI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the production process of thick copper multilayer PCB board, because of the thick copper thickness of the inner layer board (>2OZ), it is difficult to fill the copper-free area of ​​the inner layer graphics with resin during lamination. Afterwards, the problem of insufficient glue filling is easy to occur, and the existing multilayer board lamination technology usually solves this problem by increasing the resin content in the prepreg or coating a layer of resin on the outside of the prepreg, which does not affect the processing technology of the PCB board itself. Change

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  • Pre-laminating process for inner-layer core plate of thick-copper multilayer PCB

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Embodiment Construction

[0018] Such as figure 1 As shown, circuit diagrams are respectively etched on the copper foil 5 of the substrate 4 of the two inner core boards 1 of the thick copper multilayer PCB, and the inner core boards 1 are coated with resin 3, and the two inner core boards 1 is placed between prepregs 2. The pre-pressing treatment process described in this embodiment is to reach the structural state of the inner core plate 1 as shown in the figure before the pressing. The specific treatment process is as follows:

[0019] Step 1, etching the inner layer circuit pattern on the double-sided copper foil 5 of the inner layer core board 1 of the PCB board;

[0020] Step 2, using coating equipment to coat the front and back sides of the inner core board 1 with resin 3;

[0021] Step 3, use the claws on the coating equipment to clamp the edge of the inner core board 1 that has been coated with resin on the front and back sides, transfer the inner core board 1 to the baking equipment, and dr...

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Abstract

The invention relates to a pre-laminating process for an inner-layer core plate of a thick-copper multilayer PCB. After bi-side etching of line graphs on the inner-layer core plate of the PCB, and a resin layer is coated on each of the two sides of the inner-layer core plate through a coating device. After resin is dried, brown oxidation or blackening is conducted, and normal laminating is processed for the inner-layer core plate. The pre-laminating process is simple and effective, effectively solves the problem of insufficient filler after laminating of the thick-copper multilayer PCB, and prevents damage of the sheet materials caused by screen printing resin.

Description

technical field [0001] The invention belongs to the field of multilayer PCB board manufacturing technology, and in particular relates to a pretreatment process for lamination of an inner core board of a thick copper multilayer PCB board. Background technique [0002] Thick copper multilayer PCB board is an important type of printed circuit board with an increasing market share. It has good current carrying capacity and excellent heat dissipation. It is mainly used in important fields such as network power supply, communication power supply, and automotive power supply. Has broad market development prospects. [0003] The general pre-pressing process of the PCB inner core board is: first etch the inner layer circuit pattern on the inner core board, then do brown oxidation or blackening, and then perform prepreg lamination. In the production process of thick copper multilayer PCB board, because of the thick copper thickness of the inner layer board (>2OZ), it is difficult ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4641H05K3/4626H05K2203/065
Inventor 张文和
Owner HUANGSHI HUSHI ELECTRONICS CO LTD