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A Tri-band Microstrip Antenna

A technology for microstrip antennas and dielectric substrates, which is applied to antennas, antenna grounding devices, and devices that enable antennas to work in different bands at the same time. It can solve the problems of microstrip antennas with multiple frequencies, increase impedance bandwidth, and improve resonance frequency. Effect

Active Publication Date: 2019-06-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of realizing multi-frequency microstrip antenna in the prior art, the embodiment of the present invention provides a three-band microstrip antenna

Method used

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  • A Tri-band Microstrip Antenna
  • A Tri-band Microstrip Antenna
  • A Tri-band Microstrip Antenna

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Embodiment Construction

[0033] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0034] The following will combine specific implementation methods, figure 1 and figure 2 The structure of the three-band microstrip antenna shown is described in detail, and the content can be as follows:

[0035] A triple-band microstrip antenna provided by an embodiment of the present invention includes: a dielectric substrate 1, a radiation patch 2 and a ground plate 3;

[0036] The dielectric substrate 1 is arranged between the radiating patch 2 and the grounding plate 3, both the radiating patch 2 and the grounding plate 3 are arranged on the dielectric substrate 1, and the lower end of the radiating patch 2 is connected to the lower edge of the dielectric substrate 1;

[0037] see figure 1 , the grounding plate 3 includes a r...

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Abstract

The invention discloses a three-frequency micro-strip antenna, and belongs to the technical field of antennas. The three-frequency micro-strip antenna comprises a dielectric substrate, a radiation patch, and a ground plate. The dielectric substrate is arranged between the radiation patch and the ground plate, the radiation patch and the ground plate are arranged on the dielectric substrate, and the lower end of the radiation patch is connected with the lower edge of the dielectric substrate. The ground plate includes a rectangular plate and an arched plate. The lower end of the rectangular plate is connected with the lower edge of the dielectric substrate, the upper end of the rectangular plate is connected with the arched plate, and the arched side of the arched plate is away from the rectangular plate. The rectangular plate is provided with a first defect, and the arched side of the arched plate is provided with a second defect. Through the first defect and the second defect, a defected ground structure is formed on the ground plate so as to excite and improve the resonant frequency of the three-frequency micro-strip antenna and increase the impedance bandwidth.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a triple-frequency microstrip antenna. Background technique [0002] Defected Ground Structure (DGS for short) is one of the newly developed technologies in the microwave field. It is developed from the photonic bandgap structure. This structure changes the distribution of the ground current by etching periodic or non-periodic patterns on the ground plane of the transmission line such as the microstrip line, thereby changing the frequency characteristics of the transmission line, which can realize the functions of exciting resonance frequency, suppressing harmonics, and increasing bandwidth. [0003] At present, in the field of wireless communication technology, there are two methods for microstrip antennas to achieve multi-frequency: one is to use ultra-wideband antennas to cover all frequency bands, but this method is only applicable to the situation where multiple frequency b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/48H01Q5/00H01Q5/10H01Q5/28H01Q13/08
CPCH01Q1/38H01Q1/48H01Q5/00H01Q5/10H01Q5/28H01Q13/08
Inventor 熊辰念林伟伟
Owner SOUTH CHINA UNIV OF TECH