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A kind of production method of thermal conductive tape

A production method and technology of tape, applied in the directions of adhesives, film/sheet adhesives, adhesive additives, etc., can solve the problems of thermal conductivity, poor dispersion uniformity, limiting thermal conduction efficiency, etc., and achieve the distribution of thermally conductive materials. Uniform, reduced physical settling, uniform effect of curing process

Active Publication Date: 2017-11-24
HENGSHAN JIACHENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional heat-conducting silica gel and glass fiber cloth reinforced heat-conducting double-sided adhesive adopt a heat-curing process, and the air bubbles in the glue cannot be eliminated smoothly. The existence of a large number of air bubbles greatly affects the thermal conductivity of the product, which limits its heat conduction efficiency and cannot be realized Rapid heat removal
At the same time, after the thermal conductive material is added to the glue, its dispersion uniformity will deteriorate with time. As the curing progresses, the thermal conductive material will physically settle, resulting in uneven thermal conductivity of the final product.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the examples, and the contents mentioned in the examples are not intended to limit the present invention.

[0017] A kind of production method of heat-conducting adhesive tape, comprises the following steps:

[0018] Step 1. Add heat-conducting powder to 100% solid content acrylic glue with a viscosity of 500-1500cps to obtain a glue-powder mixture;

[0019] Step 2, using a high-speed homogenizer and a ball mill to perform high-speed homogeneous dispersion and grinding of the glue-powder mixture obtained in step 1 to obtain a homogeneous glue-powder mixture;

[0020] Step 3: Curing the homogeneous glue-powder mixture obtained in Step 2 with UV lamps emitting ultraviolet wavelengths of 260, 330, and 365 nm, and the thermally conductive tape can be obtained after curing.

[0021] It should be noted that in the above-mentioned emb...

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PUM

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Abstract

The invention provides a production method of heat conduction adhesive tapes, and relates to the technical field of production of industrial adhesive tapes. The method comprises the following steps: 1, adding heat conduction powder to acrylic acid glue with the viscosity of 500-1500cps and the solid content of 100% to obtain a glue-powder mixture; 2, carrying out high-speed homogenous dispersing and grinding mixing on the glue-powder mixture obtained in step 1 through a high-speed homogenizer and a ball mill to obtain a homogenous glue-powder mixture; and 3, curing the homogenous glue-powder mixture obtained in step 2 with UV lamps emitting ultraviolet lights with the wavelengths of 260nm, 330nm and 365nm to obtain the heat conduction adhesive tapes. The heat conduction adhesive tapes produced through the method provided by the invention have the advantages of no bubbles in the heat conduction adhesive tapes, uniform distribution of a heat conduction material, and uniform integral heat conduction.

Description

technical field [0001] The invention relates to the technical field of industrial tape production technology, in particular to a production method of a thermally conductive tape. Background technique [0002] With the development of science and technology, the replacement cycle of mobile phones and other electronic products is getting shorter and shorter. Consumers pay more and more attention to their comprehensive performance in the consumption of mobile phones and other electronic products. The overall performance is mainly determined by its hardware configuration and heat dissipation performance. When major mobile phone and computer manufacturers reach a bottleneck in hardware configuration, the heat dissipation performance of the product becomes their primary consideration. [0003] In terms of heat dissipation, traditional electronic products usually use thermally conductive silica gel or glass fiber cloth to reinforce the thermally conductive double-sided adhesive and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/00C09J11/04C09J7/00C09J7/02C08J3/28C08J3/24
CPCC08J3/24C08J3/28C08J2333/00C08K3/04C08K3/08C08K3/22C08K3/28C08K9/10C08K2003/2227C08K2003/282C09J7/00C09J7/28C09J11/04C09J133/00C09J2203/326C09J2301/124C09J2400/163
Inventor 刘文亮谢金沛
Owner HENGSHAN JIACHENG NEW MATERIAL