Anti-shock structure for chemical vapor deposition device

Abstract

The invention relates to an anti-shock structure for a chemical vapor deposition device, the chemical vapor deposition device includes a control unit and a heating component grounded through an RF grounding wire, the heating component is connected to an AC circuit, and the control unit has In the interlocking circuit, the AC circuit is equipped with a thermal sensor, and the thermal sensor is also connected to the internal interlocking circuit. After the RF grounding wire is disconnected, the RF signal enters the AC circuit and causes the AC circuit to The temperature changes, and the thermal sensor controls the on-off of the internal interlocking circuit according to the temperature change. The invention adopts thermal sensor to sense the thermal signal generated by the AC loop wire when the RF grounding wire is abnormal, and controls the chemical vapor deposition device through the internal interlocking loop. The structure is simple, and the fault of the RF grounding wire can be found in time; The maintenance and repair process of the vapor deposition device reduces the production cost and improves the maintenance efficiency.

Description

technical field [0001] The invention relates to a chemical vapor deposition device, in particular to an anti-shock structure for the chemical vapor deposition device. Background technique [0002] Chemical Vapor Deposition (CVD, Chemical Vapor Deposition) refers to the process of introducing the gaseous reactant or liquid reactant vapor containing the film elements and other gases required for the reaction into the reaction chamber, and a chemical reaction occurs on the surface of the substrate to form a film. In VLSI, many thin films are prepared by CVD. [0003] Such as figure 1 As shown, it is a chemical vapor deposition device that realizes the generation reaction of SiO2 by radio frequency (RF). When the RF is generated by the radio frequency generator 1 and reaches the heating part 7 through the matching network 2, the distribution network 3 and the nozzle 5, it will be grounded from the capacitor 9 through a wire connected to the heating part 7, and the serial numbe...

AI Technical Summary

Problems solved by technology

This measure has the following disadvantages: 1. Increased maintenance content, which affects maintenance efficiency; 2. Replacement of spare parts increases production costs; 3. Unable to detect sudden abnormalities in time

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