Normal-temperature chromium-free passivation liquid for electroplated copper and passivation technology of normal-temperature chromium-free passivation liquid

A chrome-free passivation and copper electroplating technology, which is applied in the coating process of metal materials, etc., can solve problems such as pollution

Inactive Publication Date: 2016-08-10
山西腾源电力工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the passivation treatment process of chromic anhydride and dichromate is often used. Although the effec

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Step (1) preparation of passivation solution

[0024] Prepare according to the chromium-free passivation solution formula provided by the present invention, concrete formula is as follows: 5.0g / L benzotriazole (BTA), 10.0g / L citric acid, 50.0ml / L hydrogen peroxide, 15.0ml / L Phosphoric acid, 1.8g / L sodium molybdate, 0.2g / L palladium chloride. The present invention firstly adds benzotriazole (BTA) into deionized water and stirs until it is completely dissolved, then adds citric acid and stirs to dissolve, then continues to add hydrogen peroxide and phosphoric acid to stir evenly, and finally adds a metal complexing agent to fully dissolve.

[0025] Step (2) pretreatment of plated parts

[0026] Use freshly plated copper-plated workpieces and passivate them directly after rinsing with tap water.

[0027] Step (3) Passivation of plated parts

[0028] Immerse the plated parts in the passivation solution at room temperature. According to the required passivation film thic...

Embodiment 2

[0033] Step (1) preparation of passivation solution

[0034] Prepare according to the chromium-free passivation solution formula provided by the present invention, concrete formula is as follows: 3.0g / L benzotriazole (BTA), 5.0g / L citric acid, 100.0ml / L hydrogen peroxide, 10.0ml / L Phosphoric acid, 4.0g / L potassium fluotitanate.

[0035] The present invention firstly adds benzotriazole (BTA) into deionized water and stirs until it is completely dissolved, then adds citric acid and stirs to dissolve, then continues to add hydrogen peroxide and phosphoric acid to stir evenly, and finally adds a metal complexing agent to fully dissolve.

[0036] Step (2) pretreatment of plated parts

[0037] Use freshly plated electro-galvanized workpieces and passivate them directly after rinsing with tap water.

[0038] Step (3) Passivation of plated parts

[0039] Immerse the plated parts in the passivation solution at room temperature. According to the required passivation film thickness, ...

Embodiment 3

[0044] Step (1) preparation of passivation solution

[0045] Prepare according to the chromium-free passivation solution formula provided by the present invention, concrete formula is as follows: 1.0g / L benzotriazole (BTA), 6.0g / L citric acid, 80.0ml / L hydrogen peroxide, 20.0ml / L Phosphoric acid, 3.0g / L cobalt nitrate. The present invention firstly adds benzotriazole (BTA) into deionized water and stirs until it is completely dissolved, then adds citric acid and stirs to dissolve, then continues to add hydrogen peroxide and phosphoric acid to stir evenly, and finally adds a metal complexing agent to fully dissolve.

[0046] Step (2) pretreatment of plated parts

[0047] Electroplated copper workpieces that have been placed for a period of time can generally be treated as follows. The surface of the plated parts can be polished sequentially with 400 mesh, 600 mesh, and 1000 mesh sandpaper. After that, it is pickled in dilute acid solution, rinsed with tap water, washed with ...

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PUM

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Abstract

The invention provides normal-temperature chromium-free passivation liquid for electroplated copper. The normal-temperature chromium-free passivation liquid for electroplated copper is characterized by comprising benzotriazole (BTA), citric acid, hydrogen peroxide, phosphoric acid and a metal complexing agent, wherein the metal complexing agent is one or two selected from sodium molybdate, potassium fluotitanate, palladium chloride, cobalt nitrate and cerous nitrate. The invention further provides a production technology of performing passivation treatment on the surface of an electroplated copper substrate at normal temperature by using the environmentally friendly chromium-free passivation liquid. Based on an existing passivation production technology, the production technology is combined to the chromium-free passivation liquid provided by the invention to obtain a stable passivation system. A film formed on the surface of an electroplated copper workpiece treated by the passivation liquid is uniform and compact, and the anti-corrosion time is long.

Description

technical field [0001] The invention relates to a normal-temperature chromium-free passivation solution for copper electroplating and a process for using the solution to passivate an electroplating copper substrate at normal temperature, belonging to the technical field of electroplating technology. Background technique [0002] Under the action of the environment, the performance of the material decreases, the state changes, and even the damage and deterioration are mainly caused by corrosion. Copper has excellent casting performance, excellent plastic processing performance, and higher strength and plasticity than ordinary pure copper. It is the most widely used material in the machinery manufacturing industry. Its standard potential is relatively positive, and there is no obvious corrosion phenomenon in dry atmosphere. , but it is sensitive in humid environment, industrial atmosphere and high temperature conditions, which leads to discoloration and corrosion during produc...

Claims

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Application Information

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IPC IPC(8): C23C22/40C23C22/34C23C22/52
CPCC23C22/34C23C22/40C23C22/52
Inventor 丁莉峰赵辉赵晓红牛宇岚李松栋李冰姚英焦汝
Owner 山西腾源电力工程有限公司
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