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Method and device for preventing wafer adhesion

A technology for sticking chips and wafers, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of manual addition, etc., and achieve the effect of improving ease of use and simplifying the operation process

Active Publication Date: 2016-08-10
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method and device for preventing wafer sticking, which can solve the problem that the operator needs to manually add the sticking-removing formula

Method used

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  • Method and device for preventing wafer adhesion
  • Method and device for preventing wafer adhesion
  • Method and device for preventing wafer adhesion

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Embodiment Construction

[0027] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0028] In order to simplify the operation steps for the operator to manually add the debonding sub-recipe, an embodiment of the present invention provides a method for preventing wafer sticking, such as figure 1 As shown, the method includes:

[0029] 101. Obtain the edited parent formula.

[0030] After the operator manually sets the parent formula through the console, the computer reads the parent formula through the preset inte...

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Abstract

The invention discloses a method and device for preventing wafer adhesion and belongs to the semiconductor manufacturing field. The objective of the invention is to solve the problem of manually adding adhesion-removing child formulas. The method of the invention includes the following steps that: an edited parent formula is obtained, wherein the parent formula is composed of child formulas of different processes and wafer paths; whether a target child formula used for executing adhesion-removing processing is added in the parent formula is detected; if the target child formula is not added into the parent formula, a pre-edited target child formula is called from a background function library; and the called target child formula is automatically added to a preset position of the parent formula, so that an improved parent formula can be obtained. The method and device of the invention is mainly applied to a semiconductor etching process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method and device for preventing wafer sticking. Background technique [0002] When performing an etching process on a wafer (also known as a silicon wafer), the robotic arm takes out the wafer from the cassette (Cassette), and puts the wafer into different process modules (Process Module) in sequence according to the needs of the process flow processing in the wafer, and put the processed wafer back into the cassette. The operator can select computer programs of different processes (also known as sub-recipes) through the console, and the wafer paths of wafers passing through different process modules, thereby editing a complete wafer process flow (also known as parent recipes). According to the result selected by the operator, the computer automatically generates the transfer sequence task (Job) of the wafer through the scheduling module (Scheduler), and the robotic...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67276
Inventor 梁小祎
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD