Plate bending measuring device and its plate bending measuring method
A measurement and plate bending technology, applied in measurement devices, optical devices, instruments, etc., can solve the problems of poor efficiency and time-consuming measurement, and achieve the effect of accurate correction and compensation
Active Publication Date: 2018-08-31
TEST RES INC
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Problems solved by technology
However, the laser method can only calculate the height of a small part of the object to be measured. Therefore, to obtain the entire height of the object to be measured, the laser must be projected on each part of the object to be measured in sequence, and this method will lead to measurement Too inefficient and takes too much time
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[0040] The following examples are described in detail in conjunction with the accompanying drawings, but the provided examples are not used to limit the scope of the present invention, and the description of the structural control is not used to limit the order of its execution. Any recombination of components Structures, resulting devices with equivalent functions are all within the scope of the present invention. In addition, the drawings are for illustrative purposes only and are not drawn to scale. For ease of understanding, the same components will be described with the same symbols in the following description.
[0041] As used herein, "about", "approximately" or "approximately" generally means that the error or range of the value is within 20%, preferably within 10%, and preferably within Within five percent. If there is no explicit statement in the text, the numerical values mentioned are all regarded as approximate values, such as errors or ranges that can be expr...
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The invention discloses a plate bending measuring device and a plate bending measuring method thereof. The method is used to measure a to-be-measured object which is placed on a measurement carrier. The method comprises: an image is projected on the to-be-measured object, and the image includes a plurality of reference points; an image capturing module is used to capture a measurement image of the image projected on the to-be-measured object, wherein the measurement image includes a plurality of measurement points corresponding to the reference points; the position of each of the measurement points in the measurement image is used by a conversion function of each corresponding reference point to calculate the height of the to-be-measured object at the position of the corresponding measurement point; and the plate bending situation of the to-be-measured object is compensated according to the height of the to-be-measured object at the position of each corresponding measurement point. Via the above way, the height of the to-be-measured object at each corresponding measurement point can be obtained, optical focal length compensation can be quickly done, and a reference point pattern can be transformed through a digital projection method, so that the local plate bending can be known according to local reference point positions, and corresponding height compensation can be conducted.
Description
technical field [0001] The invention relates to a plate bending measuring device, and in particular to a plate bending measuring device with a projection module projecting an image on an object to be measured. Background technique [0002] In recent years, due to the reduction in the size of components, many automated high-precision testing equipment have been developed to detect whether the appearance, line connection, and alignment relationship of electronic components are proper. Among them, the automatic solder paste inspection machine (Solder Paste Inspection, SPI) has been widely used in the production line to accurately measure the amount of solder paste on the substrate, as a necessary tool for the control of the printed circuit board process. [0003] In practical applications, printed circuit boards may be bent due to external stress or gravity. The plate bending phenomenon will lead to a decrease in the accuracy of the measuring device 200 in measuring the object...
Claims
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IPC IPC(8): G01B11/16
Inventor 余良彬潘映霖林际扬
Owner TEST RES INC