A Sectional Temperature Compensation Circuit
A compensation circuit and segmented temperature technology, applied in the direction of adjusting electrical variables, control/regulation systems, instruments, etc., can solve the problems of not meeting the requirements of special applications and limited application environments, so as to improve the scope of adaptation, protect loads and device, the effect of reducing the current value
Inactive Publication Date: 2017-03-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
Most of the existing temperature compensation is full temperature compensation, that is, the same compensation coefficient is used in the entire temperature range, which limits the application environment and cannot meet the requirements of some special applications
Method used
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[0019] Such as figure 2 As shown, the medium temperature trigger module in this example consists of the third resistor R3, the fourth resistor R4, the fifth resistor R5, the sixth resistor R6, the seventh resistor R7, the eighth resistor R8, the ninth resistor R9, the tenth resistor R10, the Three triodes Q3, fourth triode Q4, fifth PMOS transistor PM5 and sixth PMOS transistor PM6; wherein, the base of the third triode Q3 is connected to the power supply through the third resistor R3, and the third triode The base of the transistor Q3 is grounded after passing through the fourth resistor R4, the collector of the third transistor Q3 is connected to the power supply after passing through the fifth resistor R5, and the emitter of the third transistor Q3 is grounded; the source of the fifth PMOS transistor PM5 Connected to the power supply, its gate is connected to the power supply after passing through the fifth resistor R5, the drain of the fifth PMOS transistor PM5 is grounde...
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The invention belongs to the electronic circuit technology, and in particular relates to a segmented temperature compensation circuit. The circuit of the present invention includes a constant current module, an over-temperature trigger module and a positive temperature coefficient current source module; wherein, the constant current module keeps the current flowing through the load constant; the over-temperature trigger module is connected to the positive temperature coefficient current source module to control its opening and current size; the output terminal of the current source module is connected to the inverting input terminal of the constant current module as compensation current. The beneficial effects of the present invention are: the chip input power supply voltage increases, the chip temperature increases, the chip will not be shut down immediately, but the voltage on the resistor Rs is linearly reduced, the current value is reduced, and the power consumption and temperature of the chip are reduced; and Different temperature coefficients are used in different temperature ranges, which further improves the chip's adaptability to temperature and better protects loads and devices.
Description
technical field [0001] The invention belongs to the electronic circuit technology, and in particular relates to a segmented temperature compensation circuit. Background technique [0002] Usually, in order to prevent the chip from failing due to heat and burning, most of them have a temperature compensation function. Once the set temperature is exceeded, the operating current will be linearly reduced to maintain its continued operation and reduce the temperature. Most of the existing temperature compensation is full temperature compensation, that is, the same compensation coefficient is used in the entire temperature range, which limits the application environment and cannot meet the requirements of some special applications. [0003] Therefore, for a circuit driven by a constant current, a segmented temperature compensation circuit can well adjust the power consumption of the circuit and protect the driving circuit, and can be applied in various environments. Contents of ...
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IPC IPC(8): G05F1/567
CPCG05F1/567
Inventor 李泽宏张明汪榕万佳利李沂蒙刘玮琦黄梦意苏志恒
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA