A layer-changing wiring method, device and integrated circuit system

An integrated circuit and first-line technology, applied in printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve problems such as poor continuity of line signal impedance, high density of VIA holes, and large interference
CN105873362BActive Publication Date: 2019-01-11LANGCHAO ELECTRONIC INFORMATION IND CO LTD
3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
Publication Date
2019-01-11

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention provides a layer-changing wiring method, device and integrated circuit system. The method determines the position of each PIN pin in the BGA chip on the PCB board, sets the layer-changing threshold, and within the range of the layer-changing threshold, the PCB On the board, set the VIA holes corresponding to each PIN pin, and the VIA holes corresponding to the PIN pins are adjacent; determine the PIN pin pair, and set a symmetrical GND VIA for the VIA hole pair corresponding to the PIN pin pair; lead out each PIN pin in the PIN pin pair Corresponding signal lines; route the signal lines corresponding to each PIN through the VIA holes in the corresponding VIA hole pairs. The scheme provided by the invention effectively improves the impedance continuity of the line signal at the VIA hole.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of communications, in particular to a layer-changing routing method, device and integrated circuit system. Background technique

[0002] With the miniaturization trend of electronic products, the size of the PCB board is getting smaller and smaller, and the BGA components on the PCB board often need to change layers to achieve communication.

[0003] At present, the method of layer-changing routing is mainly to punch VIA holes on the PIN pins before BGA component packaging, and hollow out the outer edge of the VIA holes, so that the lines can be changed through the VIA holes. When simulating according to the existing layer-changing routing method, it is found that because the PIN pin density of BGA components is relatively high, and VIA holes are drilled on the PIN pins, the density of VIA holes is also relatively large, and the interference between lines is relatively large. The impedance continuity of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More