New method for solving wire pasting problem of silver and silver alloy bonding wires

A silver alloy and wire sticking technology, which is applied in furnaces, heat treatment equipment, manufacturing tools, etc., can solve problems such as easy sticking of wires and hinder development, and achieve the effects of cheap price, solving the problem of sticking wires, and easy use

Inactive Publication Date: 2016-08-24
SINO PLATINUM METALS CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the development of silver is hindered because it is easy to stick to silk after continuous annealing without treatment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Protective fluid formula: 0.5% by volume of turpentine oil, 0.5% by volume of isopropanol, 0.1% by volume of sodium cetyl sulfate, and 99.44% by volume of ethanol. Add turpentine, isopropanol, and sodium cetyl sulfate in sequence to ethanol, stir evenly, and store in the lower liquid storage chamber of the liquid circulation device. Start the temperature cycle device to circulate the protective solution for 10 minutes, then start annealing to immerse the wire in the protective solution.

Embodiment 2

[0010] Protective fluid formula: 1 part of lemon oil, 0.5 part of methanol, 0.2 part of sodium succinate, and 98.3 parts of ethanol. Add turpentine, isopropanol, and sodium cetyl sulfate sequentially to ethanol, stir evenly, and store in the lower liquid storage chamber of the liquid circulation device. Start the temperature cycle device to circulate the protective solution for 10 minutes, then start annealing to immerse the wire in the protective solution.

[0011] The method proposed by the present invention to solve the problem of silver and silver alloy bonding wire sticking wires, prepares 50 batches of silver bonding wires and 50 batches of silver alloy bonding wires, and each batch of products is sampled for 5 axes, respectively at 0 days and 15 days , 1-month, 3-month, 6-month payout, statistical stop points, no more than 5 stop points, good linearity, no axial torsion, meeting the requirements of semiconductor packaging for bonding wires.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for solving the wire pasting problem of bonding silver wires and silver alloy wires. According to the technical scheme, through the protective liquid formula, annealing furnace equipment modification is designed; protective liquid is prepared by following raw materials including 0.1 part to 5 parts of terpenic compounds, 0.1 part to 5 parts of alcoholic hydroxyl group organic solutions, 0.01 part to 1 part of a surface active agent and 89 parts to 99.9 parts of a thinning agent; the terpenic compounds are turpentine or lemon oil, the alcoholic hydroxyl group organic solutions are isopropyl alcohol or methyl alcohol or ethylene glycol butyl ether, the surface active agent is cetyl sodium sulfate, succinate sodium salt, and fatty alcohol polyoxyethylene ether sodium salt/fatty alcohol polyoxyethylene ether; and the thinning agent is ethyl alcohol. The method is easy to operate, the protective liquid is good in spreading wettability and stability, the service life of the bonding silver wires and the silver alloy wires is prolonged, the application bottleneck of gold wire replacement by the bonding silver wires is broken through, and the market application of silver-based bonding wires is promoted.

Description

technical field [0001] The invention relates to the technical field of manufacturing bonding wires for microelectronic packaging, especially the problem of bonding silver and silver alloy bonding wires Background technique [0002] Filament sticking is a phenomenon in which filaments are bonded together when filaments are annealed. Sticking wire is a serious quality problem in the production process of bonding wire, resulting in poor wire diameter, axial curl, and poor surface quality, which cannot meet the requirements of high-speed bonding machines for wire materials. Silver is the preferred material for bonding wire due to its good electrical and thermal conductivity and low cost. However, the development of silver is hindered because it is very easy to stick to silk after continuous annealing without treatment. A commonly used method to solve the problem of sticking wire is to coat a layer of protective film on the surface of the wire. Requirements for bonded silver w...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C22F1/14C21D1/70C21D1/26C21D9/54
CPCC21D1/26C21D1/70C21D9/54C22F1/14
Inventor 康菲菲杨国祥孔建稳吴永瑾
Owner SINO PLATINUM METALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap