Integrated loop heat pipe cooling device with boiling pool

Abstract

An integrated loop heat pipe cooling device with a boiling pool comprises an evaporator, the boiling pool and a condenser, wherein the evaporator comprises a compensating chamber; a capillary core for providing power is arranged below the compensating chamber; a steam channel is formed below the capillary core; an air collecting groove which communicates with the steam channel is formed between the compensating chamber and the boiling pool; a connecting hole which communicates with the air collecting groove is formed in a side wall of the boiling pool; steam generated from the bottom of the compensating chamber enters the air collecting groove and enters the boiling pool through the connecting hole; the compensating chamber communicates with an outlet of the condenser; and the boiling pool communicates with an inlet of the condenser. The evaporator for proving power and the boiling pool as a main cooling component are integrally designed, the integral size is small, the structure is compact, the integrated loop heat pipe cooling device is suitable for cooling electronic devices with small space, by the compact design of the evaporator and the boiling pool, a system only needs a heat source which is a cooled device, an additional heat source or a power device is not required, energy is saved, and the electronic devices can be continuously and efficiently cooled.

Description

technical field [0001] The invention belongs to the field of cooling and heat dissipation of electronic components, and relates to a heat pipe heat dissipation device, in particular to an integrated loop heat pipe heat dissipation device with a boiling pool. Background technique [0002] With the development of MEMS (Micro-Electro-Mechanical-Systems) technology, the scale and integration of electronic devices are getting higher and higher, and their heat generation is also increasing sharply. How to efficiently dissipate this part of the heat has become a constraint for electronic devices. major issues of development. Traditional air cooling, water cooling and other methods can no longer meet the heat dissipation requirements under this high heat flux density. [0003] Phase change heat transfer technology has become the main direction of this research, which utilizes the latent heat of vaporization of liquid working fluid, and its heat transfer coefficient is much greater ...

AI Technical Summary

Problems solved by technology

[0011] The purpose of the present invention is to solve the problems of low heat transfer coefficient, low operation stability and complicated structure of the existing loop heat pipe radiator, and propose an integrated loop heat pipe cooling device with a boiling pool, which has a large heat transfer coefficient, Simple structure, stable operation, and efficient heat dissipation of electronic devices under high heat flux

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