Unlock instant, AI-driven research and patent intelligence for your innovation.

Thermal treatment of electronic devices

A technology for electronic devices, thermal processing, applied to devices, circuits, electrical components, etc. that apply liquid to surfaces, and can solve problems such as increased maintenance requirements, mechanical instability, and limiting the maximum size of substrates

Inactive Publication Date: 2016-08-24
KATEEVA
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such direct patterning via a shadow mask adds significant complexity to vacuum-based deposition techniques, which typically involve additional mechanisms and fixtures to accurately manipulate and position the mask relative to the substrate, further increasing material waste (due to waste of material deposited onto the mask) and further increases the need for maintenance to continually clean and replace the mask itself
Shadow mask technology also typically involves relatively thin masks to achieve the pixel-scale patterning required for display applications, and such thin masks are mechanically unstable over large areas, limiting the maximum size of substrates that can be processed
Improving stability remains a major challenge for OLED manufacturing, so such limitations on scalability can be significant

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal treatment of electronic devices
  • Thermal treatment of electronic devices
  • Thermal treatment of electronic devices

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0177] Example 1 can include or use subject matter (e.g., an apparatus, method, means for performing an action, or an apparatus-readable medium comprising instructions that, when executed by an apparatus, can cause the apparatus to perform an action), for example it can include or use An electronic device manufacturing system comprising: a first printing system configured to deposit a first patterned organic layer on a substrate, the patterned layer including at least a portion of a light emitting device fabricated on the substrate, the The first printing system is located in a first processing environment comprising a controlled environment constructed to remain below specified limits for particulate contamination levels, water vapor content, and ozone content; an enclosed thermal processing module comprising thermal control regions in a stacked configuration, the thermal control regions being offset from each other and each configured to receive a substrate, including providi...

example 2

[0178] Example 2 can include or can optionally be combined with the subject matter of Example 1 to optionally include an enclosed substrate cooling module including one or more substrate holding regions each configured to receive a substrate, the a substrate cooling module configured to hold the substrate for a specified duration to include cooling the substrate until the substrate is below a specified threshold temperature, the enclosed cooling module configured to establish a third processing environment comprising A controlled environment constructed to remain below specified limits for particulate pollution levels, water vapor content, oxygen content, and ozone content.

example 3

[0179] Example 3 can include or can optionally be combined with the subject matter of Example 2 to optionally include a substrate transfer module configured to receive a substrate from a second processing environment within an enclosed thermal processing module and configured to transfer The substrate is provided to a third processing environment within the enclosed cooling module.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Apparatus and techniques are described herein for use in manufacturing electronic devices such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

Description

[0001] priority claim [0002] This patent application claims the benefit of priority to each of the following: [0003] (1) U.S. Provisional Patent Application Serial No. 61 / 921,034, filed December 26, 2013, entitled "DISPLAY DEVICE FABRICATION SYSTEMS AND TECHNIQUES USING INERT ENVIRONMENT"; (2) Filed December 27, 2013, titled "DISPLAY DEVICE FABRICATION SYSTEMS AND TECHNIQUES USING INERT ENVIRONMENT", U.S. Provisional Patent Application Serial No. 61 / 921,218; (3) U.S. Provisional Patent Application Serial No. 61 / 921, filed February 26, 2014, entitled "DISPLAY DEVICE FABRICATION SYSTEMS AND TECHNIQUES USING INERT ENVIRONMENT" 929,668; (4) U.S. Provisional Patent Application Serial No. 61 / 945,059, filed February 26, 2014, entitled "DISPLAY DEVICE FABRICATION SYSTEMS AND TECHNIQUES USING INERT ENVIRONMENT"; (5) filed March 14, 2014, entitled " DISPLAY DEVICE FABRICATION SYSTEMS AND TECHNIQUES USING INERT ENVIRONMENT” U.S. Provisional Patent Application Serial No. 61 / 947,671; (6...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L51/56H01L51/50H01L51/00
CPCH01L21/6715H01L21/67207H01L21/67201H01L21/67167H01L21/6719H01L21/67196H01L21/67161H10K71/135H10K71/40H10K71/811H10K71/00H01L21/67225H01L21/67393
Inventor C.F.马迪根E.弗龙斯基A.S-K.高J.莫克
Owner KATEEVA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More