Thermal treatment of electronic devices
A technology for electronic devices, thermal processing, applied to devices, circuits, electrical components, etc. that apply liquid to surfaces, and can solve problems such as increased maintenance requirements, mechanical instability, and limiting the maximum size of substrates
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example 1
[0177] Example 1 can include or use subject matter (e.g., an apparatus, method, means for performing an action, or an apparatus-readable medium comprising instructions that, when executed by an apparatus, can cause the apparatus to perform an action), for example it can include or use An electronic device manufacturing system comprising: a first printing system configured to deposit a first patterned organic layer on a substrate, the patterned layer including at least a portion of a light emitting device fabricated on the substrate, the The first printing system is located in a first processing environment comprising a controlled environment constructed to remain below specified limits for particulate contamination levels, water vapor content, and ozone content; an enclosed thermal processing module comprising thermal control regions in a stacked configuration, the thermal control regions being offset from each other and each configured to receive a substrate, including providi...
example 2
[0178] Example 2 can include or can optionally be combined with the subject matter of Example 1 to optionally include an enclosed substrate cooling module including one or more substrate holding regions each configured to receive a substrate, the a substrate cooling module configured to hold the substrate for a specified duration to include cooling the substrate until the substrate is below a specified threshold temperature, the enclosed cooling module configured to establish a third processing environment comprising A controlled environment constructed to remain below specified limits for particulate pollution levels, water vapor content, oxygen content, and ozone content.
example 3
[0179] Example 3 can include or can optionally be combined with the subject matter of Example 2 to optionally include a substrate transfer module configured to receive a substrate from a second processing environment within an enclosed thermal processing module and configured to transfer The substrate is provided to a third processing environment within the enclosed cooling module.
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