Damping material, preparation method thereof and piezoelectric ceramic ultrasonic probe

Abstract

The invention discloses a damping material, a preparation method thereof and a piezoelectric ceramic ultrasonic probe. The damping material comprises the following components in parts by weight: 60-120 parts of high-molecular polymer, 30-60 parts of inorganic fillers with sheet structure, 5-15 parts of inorganic fillers with ball structure, 0.5-5 parts of silane auxiliaries and 10-30 parts of solvents. The damping material provided by the invention can effectively prevent the long curing time and insufficient conduction caused by the increase of tungsten powder content as well as the interference to the ultrasonic signal caused by the middle layer formed by bonding the damping block with the piezoelectric ceramic wafer of the present damping material; the curing time is stable, the material is non-conducting and the damping coefficient is higher; a filling method is applied to the piezoelectric ceramic ultrasonic probe, so that the vibration damping of the piezoelectric ceramic wafer is greatly increased; the vibration time of the piezoelectric ceramic wafer is shortened; the absorption of the piezoelectric ceramic wafer for the echo signal is benefited; the definition of ultrasonic testing for multilayer gluing structure defect is increased.

Description

technical field [0001] The invention relates to a damping material, in particular to a damping material and a preparation method thereof, and a piezoelectric ceramic ultrasonic probe, belonging to the technical field of ultrasonic detection. Background technique [0002] Compared with welding, riveting and bolt connection, adhesive connection (referred to as glue connection) has the advantages of small structural mass, uniform stress distribution, smooth surface of glued surface and good aerodynamic performance, and can connect different thicknesses and different materials. Its application The field is more and more extensive, such as window glass bonding, sealing, parts bonding, etc. The quality of bonding is affected by many factors in the actual production process. During the service process, due to factors such as environment, load and vibration fatigue, aging, cracks, damage to the adhesive layer, and cohesive damage to the bonding layer may occur on the bonded parts. ...

AI Technical Summary

Problems solved by technology

However, the increase of tungsten powder content will prolong the curing time of the damping layer on the one hand, and increase the high-frequency conductivity of the damping layer on the other hand, which will affect the high-frequency performance of the probe.

[0005] In order to overcome the shortcoming of long curing time caused by the increase of tungsten powder content in the existing damping materials, it is often pre-prepared into a damping block, and then the damping sheet and the piezoelectric ceramic chip are bonded together with epoxy resin

If the epoxy resin bonding layer is not thin enough, it is equivalent to adding an intermediate layer between the piezoelectric ceramic chip and the damping layer, both sides will emit ultrasonic waves, and additionally increase the blind area of ​​ultrasonic detection

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