Method for improving heat conductive capacity of printed board of surface mounting device
A technology of surface mount devices and thermal conductivity, applied in electrical components, printed circuits, printed circuits, etc., can solve the problems of low heat dissipation reliability of thermal conduction paths, low thermal conductivity of thermal printed boards, and high temperature of device shells. It is easy to accumulate design experience and knowledge, has reproducibility and scalability, and achieves the effect of thermal conductivity.
Inactive Publication Date: 2016-09-14
合肥仁德电子科技有限公司
View PDF0 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0010] The purpose of the present invention is to propose a theoretically instructive method for the disadvantages of the above-mentioned existing technology, such as low heat conduction performance, long heat conduction path, and large heat conduction resistance, which lead to high device shell temperature and poor thermal reliability. 、A highly operable design and process implementation method to solve the defect of low heat dissipation reliability of the heat conduction path of surface mount devices with high heat flux density under low air pressure or vacuum conditions
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0024] The specific implementation steps of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0025] When using this method to design, the heat conduction path should be optimized according to the assembly relationship of the device, the printed board and the metal box body, and the device is determined to be a surface soldered device. figure 1 The path 8 shown is the same or similar. This method can only be used when the heat dissipation characteristics during surface mounting can be effectively improved by improving the thermal conductivity of the printed board.
[0026] Refer to Figure 1~Figure 3 . figure 1 It shows that the high heat flux surface mount device 2 is installed on the bottom with a metal heat dissipation boss, and the surface mount device that can be welded to the ground plating of the printed board 1 through the SMT process belongs to the third installation method, its component 2, the chassis The ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a method for improving heat conductive capacity of a printed board of a surface mounting device and aims at providing a realization method with guidance and operability. The realization method is specific to the defects that in the prior art, the working temperature is high and the heat reliability is low due to the fact that the heat conductive property of the heat conductive printed board is low, the heat conductive paths are long and the heat conductive resistance is high. The method is realized through the technical scheme of determining layout of plated-through holes and heat conductive copper pins according to a power parameter range of the high heat flux surface mounting device; establishing heat conductive paths with reproducibility and extensibility according to the determined assembly relationships among the surface mounting device of which bottom surface is equipped with a metal welding surface, the printed board and a metal box; sealing all heat conductive through holes by use of high temperature resistant adhesive tapes at the reverse sides of the heat conductive through holes of the printed board of the surface mounting device; and pressing the heat conductive copper pins into the corresponding heat conductive through holes and carrying out welding. According to the method, the defect that the heat conductive reliability of the heat conductive paths of the high heat flux surface mounting device is low in low air pressure or vacuum is solved.
Description
Technical field [0001] The present invention relates to a method for improving the thermal conductivity of surface-mounted device printed boards, and relates to the design and assembly process of surface-mounted device printed boards and thermal conductive copper pins, especially high heat flux surface mounts that work under low air pressure and vacuum conditions. Install device electronic equipment. Background technique [0002] In space-borne payload products, most of the packaging forms during surface mounting with high heat flux are non-airtight structures and are in (10 -6 ~10 -7 Pa) It operates in a vacuum environment and faces the requirements of long life and high reliability. Thermal design is one of the most important contents in the development. Poor heat dissipation will lead to high heat flux density surface mount device package shell temperature higher, thermal reliability is poor, and at the same time, the air often used in ground electronic equipment, convection h...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0204H05K2201/10416
Inventor 李阳
Owner 合肥仁德电子科技有限公司