Method for improving heat-conducting capability of printed board for surface mount device
A technology of surface mount devices and thermal conductivity, which is applied in the manufacture of printed circuits, assembly of printed circuits with electrical components, electrical components, etc., can solve the problem of low heat dissipation reliability of thermal conduction paths, low thermal conductivity of thermally conductive printed boards, and device housings. Problems such as high temperature, to achieve the effect of easy design experience and knowledge accumulation, reproducibility and scalability, and thermal conductivity
Inactive Publication Date: 2016-09-28
合肥羿振电力设备有限公司
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[0010] The purpose of the present invention is to propose a theoretically instructive method for the disadvantages of the above-mentioned existing technology, such as low heat conduction performance, long heat conduction path, and large heat conduction resistance, which lead to high device shell temperature and poor thermal reliability. 、A highly operable design and process implementation method to solve the defect of low heat dissipation reliability of the heat conduction path of surface mount devices with high heat flux density under low air pressure or vacuum conditions
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[0024] The specific implementation steps of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0025] When using this method to design, the thermal conduction path should be optimized according to the assembly relationship of the device, printed board and metal box body, and the device is determined to be a surface soldered and mounted device, and its thermal conduction path is the same as figure 1 The same or a similar situation is shown for path 8 . This method can only be used when the heat dissipation characteristics during surface mount can be effectively improved by increasing the thermal conductivity of the printed board.
[0026] refer to Figure 1~Figure 3 . figure 1 It shows that the high heat flux surface mount device 2 is installed on the bottom with a metal heat dissipation boss, and the surface mount device that can be soldered to the grounding layer of the printed board 1 through the SMT process b...
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The method for improving the thermal conductivity of printed boards of surface mount devices proposed by the present invention aims to solve the problems of low thermal conductivity, long thermal conduction path, and large thermal conduction resistance in the prior art, resulting in high operating temperature and poor thermal reliability. Where, a guiding and operable implementation method is provided. The present invention is realized through the following technical solutions: firstly, according to the power consumption parameter range of the high heat flux surface mount device, determine the layout of the metallized hole and the heat conduction copper pin; according to the determined surface mount device with a metal welding surface on the bottom surface , the assembly relationship between the printed board and the metal box, and establish a heat conduction path with reproducibility and scalability; Seal it with tape; press the heat-conducting copper pins into the corresponding heat-conducting through holes and solder them. The invention solves the defect of low heat conduction reliability of the heat conduction path of the surface mounting device with high heat flux density under low air pressure or vacuum.
Description
technical field [0001] The invention relates to a method for improving the thermal conductivity of a printed board of a surface mount device, and relates to a design and assembly process of a printed board of a surface mount device and a heat conduction copper pin, especially a surface mount device with high heat flux working under low pressure and vacuum conditions. Install electronic equipment. Background technique [0002] In starborne payload products, most of the packaging forms during surface mount with high heat flux are non-airtight structures, and are in (10 -6 ~10 -7 Pa) operating in a vacuum environment, facing the requirements of long life and high reliability, thermal design is one of the very important contents in the development. Poor heat dissipation will lead to high heat flux surface mount device packaging shell temperature and poor thermal reliability. At the same time, the air often used in ground electronic equipment, various convective heat dissipatio...
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IPC IPC(8): H05K3/34H05K1/02
CPCH05K3/3415H05K1/0204H05K1/021H05K2201/10416
Inventor 武行峰
Owner 合肥羿振电力设备有限公司