Method for improving thermal conduction capacity of printed board of surface-mount device

Abstract

The invention provides a method for improving the thermal conduction capacity of a printed board of a surface-mount device, and aims to provide an instructive and operable realization method for overcoming the defects of a thermal conduction printed board in the prior art such as low thermal conductivity, long thermal conduction path, large thermal conduction resistance, high working temperature and low thermal reliability. The method is realized through the following technical scheme: first, the layout of plated through holes and thermal conduction copper pins is determined according to the power consumption parameter range of a high-heat-flux surface-mount device; a replicable and scalable thermal conduction path is established according to the determined assembly relationship among the surface-mount device with a metal welding surface on the bottom surface, a printed board and a metal box; then, all thermal conduction through holes are sealed by adhesive tapes resistant to high temperature in the opposite positions of the thermal conduction through holes of the surface-mount device on the surface of the printed board; and the thermal conduction copper pins are respectively pressed and welded into the corresponding thermal conduction through holes. The problems existing in a high-heat-flux surface-mount device in a low-pressure or vacuum environment such as long thermal conduction path and low thermal conduction reliability are solved.

Description

Technical field [0001] The present invention relates to a method for improving the thermal conductivity of surface-mounted device printed boards, and relates to the design and assembly process of surface-mounted device printed boards and thermal conductive copper pins, especially high heat flux surface mounts that work under low air pressure and vacuum conditions. Install device electronic equipment. Background technique [0002] In space-borne payload products, most of the packaging forms during surface mounting with high heat flux are non-airtight structures and are in (10 -6 ~10 -7 Pa) It operates in a vacuum environment and faces the requirements of long life and high reliability. Thermal design is one of the most important contents in the development. Poor heat dissipation will lead to high heat flux density surface mount device package shell temperature higher, thermal reliability is poor, and at the same time, the air often used in ground electronic equipment, convection ...

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to propose a theoretically instructive method for the disadvantages of the above-mentioned existing technology, such as low heat conduction performance, long heat conduction path, and large heat conduction resistance, which lead to high device shell temperature and poor thermal reliability. 、A highly operable design and process implementation method to solve the defect of low heat dissipation reliability of the heat conduction path of surface mount devices with high heat flux density under low air pressure or vacuum conditions

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