An auxiliary manual wafer bonding device

A wafer bonding and wafer technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as wafer surface pollution, affecting bonding quality, bonding interface defects, etc., to reduce The effect of pollutants introduced by the surrounding environment and human operation, shortening the manual operation time, and improving the effect

Active Publication Date: 2018-03-30
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this fully automated equipment is mainly used for industrial mass production and the price is very high. In the bonding research and development stage, scientific researchers often use manual bonding to explore the development of the process.
In the manual bonding process, wafer cleaning, drying, loading, and bonding are relatively independent steps. Due to human operations (such as direct contact with the edge or surface of the wafer with gloved hands), it is easy to cause damage to the surface of the wafer. The contamination of the bonding interface will cause defects, which will affect the bonding quality to a large extent.

Method used

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  • An auxiliary manual wafer bonding device
  • An auxiliary manual wafer bonding device
  • An auxiliary manual wafer bonding device

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Experimental program
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specific Embodiment approach 1

[0025] Specific implementation mode one: combine Figure 1~Figure 3 Describe this embodiment, the auxiliary wafer bonding device in this embodiment consists of a long right-angle elbow joint 1, a wafer slot A 2, a wafer slot B 3, a fixed angle (180°) hinge 4, and a buffer block A 5 , buffer block B6, linear bearing A 7, linear bearing B 8, linear bearing C 9, linear optical axis A 10, linear optical axis B 11, linear optical axis C 12, spring A 13, spring B 14, spring C 15, Linear bearing connector 16 and base 17 constitute, wherein:

[0026] The central position of the wafer slot A 2 is provided with a central through hole with a diameter of 4 mm so as to be connected to the shorter end of the long right-angle elbow joint 1; the upper surface of the wafer slot A 2 is in the shape of an "Ω" Groove-shaped, and its depth is slightly higher than the height of the longer end of the long right-angle elbow joint 1 by 0.5-1.0 mm; the lower surface of the wafer slot A 2 is provided w...

specific Embodiment approach 2

[0034] Specific implementation mode two: combination Figure 4~Figure 7 To illustrate this embodiment, a 3-inch silicon wafer passes through an RCA solution (NH 4 OH:H 2 o 2 :H 2 O = 0.01~0.25:1:5) and after wet cleaning with deionized water, if Figure 4 As shown, use tweezers to pick up the wafers and place them in wafer slot A and wafer slot B respectively, and start the vacuum generating device connected to the long right-angle elbow joint to suck the wafer in wafer slot A to prevent Wafers fall off during the transfer of wafer tank A.

[0035] After the wafers are placed in wafer slot A and wafer slot B, use a nitrogen gun to dry up the liquid adsorbed on the wafer surface, such as Figure 5 As shown, since the periphery of the wafer is slightly higher than the edge of wafer slot A and wafer slot B, and there are no fingers blocking the surrounding area, the problem of wafer surface contamination due to stagnation of liquid will not be caused.

[0036] After the waf...

specific Embodiment approach 3

[0037] Specific implementation mode three: combination Figure 8To illustrate the embodiment of the present invention, the device for assisting wafer bonding is not only applicable to accomplish the above steps, but also applicable to dry surface treatment using ultraviolet light irradiation, and then performing wafer bonding.

[0038] After drying the wafer, use an ultraviolet light source (such as wavelength 172 nm, light intensity 10 mW / cm 2 ) to irradiate the surfaces of two wafers for 20 minutes at the same time, to remove the organic pollution (such as dust particles, etc.) attached to the surface, and to improve the hydrophilicity of the surface. Since ultraviolet light will be absorbed by oxygen in the air to a large extent, when the wafer is irradiated with ultraviolet light, the distance between the ultraviolet tube light source and the surface of the wafer to be processed should be strictly controlled (<5 mm ). After the ultraviolet light irradiation is completed,...

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Abstract

Provided is an auxiliary hand-operated wafer bonding apparatus including a long elbow bend joint, a wafer groove A, a wafer groove B, a fixed angle hinge, a buffer block A, a buffer block B, a linear bearing A, a linear bearing B, a linear bearing C, a linear optical axis A, a linear optical axis B, a linear optical axis C, a spring A, a spring B, a spring C, a linear bearing connecting member, and a base, the short end of the long elbow bend joint is in interference fit with the center of the wafer groove A, the wafer groove A is fixedly connected with the linear bearing C via the fixed angle hinge, the wafer groove B is fixedly connected with the base via the three linear optical axes, the three springs are in clearance fit with the three linear optical axes and are arranged at the ends close to the base, the three linear bearings are in interference fit with the three linear optical axes and are fixedly connected with the upper ends of the three springs, and the buffer A and the buffer B are fixedly connected with the linear bearing A and the linear bearing B. The auxiliary hand-operated wafer bonding apparatus prevents the direct contact between one's hands and a wafer and improves the hand-operated wafer bonding quality.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a simple wafer bonding device, which can assist in manually completing the entire process of wafer loading, drying, surface treatment and bonding on a cleaned wafer. Background technique [0002] Wafer direct bonding (also known as direct wafer bonding) relies on the natural attraction between surfaces in the case of very smooth and flat, clean contact surfaces to achieve connection under clean environmental conditions. This technology is widely used in semiconductor, biomedical chip and optoelectronic device manufacturing and other fields. The bonding process generally needs to clean the wafer before bonding, perform surface treatment, and then load the wafer into the bonding equipment for bonding. In order to minimize the contamination of the bonding surface by the external environment, the ideal situation is to complete the entire process of wafer cleaning, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/741
Inventor 王晨曦许继开田艳红刘艳南曾小润王春青
Owner HARBIN INST OF TECH
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