An auxiliary manual wafer bonding device

Abstract

Provided is an auxiliary hand-operated wafer bonding apparatus including a long elbow bend joint, a wafer groove A, a wafer groove B, a fixed angle hinge, a buffer block A, a buffer block B, a linear bearing A, a linear bearing B, a linear bearing C, a linear optical axis A, a linear optical axis B, a linear optical axis C, a spring A, a spring B, a spring C, a linear bearing connecting member, and a base, the short end of the long elbow bend joint is in interference fit with the center of the wafer groove A, the wafer groove A is fixedly connected with the linear bearing C via the fixed angle hinge, the wafer groove B is fixedly connected with the base via the three linear optical axes, the three springs are in clearance fit with the three linear optical axes and are arranged at the ends close to the base, the three linear bearings are in interference fit with the three linear optical axes and are fixedly connected with the upper ends of the three springs, and the buffer A and the buffer B are fixedly connected with the linear bearing A and the linear bearing B. The auxiliary hand-operated wafer bonding apparatus prevents the direct contact between one's hands and a wafer and improves the hand-operated wafer bonding quality.

Description

technical field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a simple wafer bonding device, which can assist in manually completing the entire process of wafer loading, drying, surface treatment and bonding on a cleaned wafer. Background technique

[0002] Wafer direct bonding (also known as direct wafer bonding) relies on the natural attraction between surfaces in the case of very smooth and flat, clean contact surfaces to achieve connection under clean environmental conditions. This technology is widely used in semiconductor, biomedical chip and optoelectronic device manufacturing and other fields. The bonding process generally needs to clean the wafer before bonding, perform surface treatment, and then load the wafer into the bonding equipment for bonding. In order to minimize the contamination of the bonding surface by the external environment, the ideal situation is to complete the entire process of wafer cleaning, ...

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