Production method of large size tin spraying printed circuit board
A manufacturing method and circuit board technology, which is applied to the assembly of printed circuits with electrical components, metallurgical bonding, and the sequence of processing steps, can solve problems such as the inability to complete large-sized tin-sprayed boards, increase the protective glue process, improve process capabilities, The effect of large market prospects and economic value
Active Publication Date: 2016-09-28
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0003] For this reason, the technical problem to be solved by the present invention is to overcome the technical bottleneck in the prior art that the large-size HASL cannot be completed, thereby proposing a method for manufacturing a large-size HASL circuit board that improves the ability of HASL
Method used
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Experimental program
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Effect test
Embodiment 1
[0015] Embodiment 1 This embodiment discloses a method for manufacturing a large-size HASL circuit board. The process of the method is as follows:
[0016] S1: previous process;
[0017] S2: silk screen solder mask characters;
[0018] S3: The first lead-free HASL: Spray a uniform layer of tin, control 1-20μm; among them, the spray board only sprays 60%-70% of the board, the temperature is: 260°C-270°C, the tin spray time 5-8 seconds;
[0019] S4: Paste red tape: Paste the tape on the tin surface between the tinned and unsprayed tin (because the board is too large, it can only be sprayed to 60%-70% of the board when the tin is sprayed for the first time, so the board surface There is a junction between HASL and non-HATS, and the tape is attached to the HASL surface close to the junction), with a width of 50mm-100mm;
[0020] S5: Pressing red tape: Put the board with red tape into the glue press machine, and press it at high temperature (the temperature of the high temperatu...
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Abstract
The invention belongs to the printed circuit board, to be specific, relates to a production method of a large size tin spraying printed circuit board. The production method comprises a silk screen resistance welding character treatment, a first-time tin spraying treatment, an adhesive tape attaching treatment, a second-time tin spraying treatment, a third-time tin spraying treatment sequentially. By adopting the production method, a single printed circuit board having a size of 620-1200mm is produced, and the tin spraying production capability is improved. A length of a tin spraying surface is the same as a length of a SET size, and the adhesive tape protection process is additionally provided, and then the temperature range is controlled, and by adopting three times of tin spraying processes, the single printed circuit board having a larger size can be produced, and therefore a great market prospect and a great economic value are provided.
Description
technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a method for manufacturing a large-sized tin-sprayed circuit board. Background technique [0002] At present, in the field of multi-layer circuit board processing, the processing steps of tin-spraying and washing boards are mostly: pre-treatment-hanging-board-spraying-tin-post-processing and washing boards; but this technology can only produce boards with a size of ≤620mm, exceeding This process range cannot be produced. Therefore, it is an urgent matter in this field to find a method for making a large-size HASL that improves the ability of HASL. Contents of the invention [0003] Therefore, the technical problem to be solved by the present invention is to overcome the technical bottleneck in the prior art that the large-size HASL cannot be completed, thereby proposing a method for manufacturing a large-size HASL circuit board that improves the ability of H...
Claims
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IPC IPC(8): H05K3/34
CPCH05K3/34H05K2203/04H05K2203/14
Inventor 白会斌黄力王海燕李渊
Owner JIANGMEN SUNTAK CIRCUIT TECH