Terminal Impedance Adjustment Method

Abstract

A method for adjusting terminal impedance is provided, which is adapted for adjusting a terminal impedance of a differential signal receiver, and the adjusting method comprises the following steps. A current value of a differential signal flowing though the terminal impedance is detected by a current detecting circuit. Characteristic points of the differential signals are determined by a micro controller according to the current value of the differential signal. A distortion status of the differential signal is determined by the micro controller according to the characteristic points. An impedance value of the terminal impedance is adjusted by the micro controller according to the distortion status of the differential signal. The method for adjusting terminal impedance in the embodiment of the invention determines the distortion status of the signal according to the signal current value flowing through the terminal impedance and adjusts the terminal impedance according to the distortion status so as to improve signal distorting phenomena.

Description

technical field [0001] The present invention relates to an impedance adjustment method, and in particular to a terminal impedance adjustment method of a differential signal receiver. Background technique [0002] In recent years, due to the improvement of the resolution of the panel, in order to meet the large amount of data transmission requirements of the high-resolution panel, the transmission interface of the panel driver must adopt a high-speed data transmission interface. However, the high-speed signal data transmission interface is easily disturbed by trace impedance and signal trace layout method. For a differential signal receiver, the high-speed signal data transmission interface has very strict requirements on the impedance matching of the equivalent impedance of the trace and the terminal impedance. [0003] Although the equivalent impedance of the traces can be controlled by the layout of the traces and the processing parameters of the printed circuit board, so...

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Problems solved by technology

[0003] Although the equivalent impedance of the traces can be controlled by the layout of the traces and the processing parameters of the printed circuit board to meet the requirements of impedance matching, the equivalent impedance of the traces may still be affected by, for example, the tolerance of the conductor film thickness and the tolerance of the substrate mold thickness. , bonding (bonding) contact impedance and other force majeure factors, resulting in equivalent impedance offset and discontinuity, resulting in signal distortion, and causing display image errors

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