Optical module

A technology of optical modules and optical components, which is applied in the field of optical modules, can solve problems such as poor sealing performance and poor heat insulation performance, and achieve the effects of ensuring sealing performance, optimizing structure, and ensuring signal integrity

Active Publication Date: 2019-06-18
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the increase of single-wave rate, the signal integrity problem of high-speed signal is also highlighted, because the signal integrity problem caused by high impedance, poor sealing performance, poor heat insulation performance, etc. becomes very serious

Method used

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0022] ginseng Figure 1 to Figure 4 , An embodiment of the present invention provides an optical module, the optical module includes a housing and a main body 100 disposed in the housing. The housing specifically includes an upper housing 91 and a lower housing 92 that are assembled and connected, and the upper housing 91 and the lower housing 92 enclose an accommodation chamber; the main body 100 includes a first circuit board 10 disposed in the accommodation chamber, The second circuit board 20, the electrical components arranged on the first circuit board 10, and the semiconductor optical element ...

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Abstract

The invention discloses an optical module. The optical module includes a shell, and a semiconductor optical element, a first circuit board and a second circuit board arranged in the shell, the first circuit board comprises a first substrate, a first transmission metal layer and a second transmission metal layer successively formed at on the upper surface of the first substrate, and a dielectric layer formed between the first transmission metal layer and the second transmission metal layer. The first transmission metal layer is provided with a signal transmission window, the second circuit board comprises a second substrate, a third transmission metal layer formed on the lower surface of the second substrate, and a fourth transmission metal layer formed on the upper surface of the second substrate, one end of the second circuit board is electrically connected with the semiconductor optical element, the third transmission metal layer at the other end of the second circuit board is arranged on the signal transmission window and electrically connected with the first transmission metal layer through the signal transmission window, and the fourth transmission metal layer and the second transmission metal layer are electrically connected.

Description

technical field [0001] The invention relates to an optical module and belongs to the technical field of optical communication component manufacturing. Background technique [0002] In the field of optical modules, with the development of optical communication technology, especially the greatly improved signal transmission rate, more stringent challenges are posed to the interconnection between circuit boards and semiconductor optical components. Specifically, the current industry will use a single-wavelength 50G, or even a baud rate of about 100G, which is greatly improved compared with the single-wavelength bandwidth rate of the 4X25Gb / S form of the common 100G module. With the increase of the single-wave rate, the signal integrity problem of high-speed signals is also highlighted. The signal integrity problem caused by excessive impedance, poor sealing performance, and poor heat insulation performance has become very serious. Contents of the invention [0003] The purpo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/14G02B6/42
Inventor 赵天宇刘能
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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