Laminating and heating device for materials
A silica gel heating and multi-layer material technology, applied in lamination devices, lamination, layered products, etc., can solve problems affecting the quality of multi-layer circuit board substrates, no circuit implementation plan, thickness differences, etc., to achieve Small error, strong resistance to external impact, good effect of multi-layer lamination
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[0039] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.
[0040] Such as figure 1 As shown, it is a device capable of laminating and heating materials in a preferred embodiment of the present invention, including: an integrated support 1, a jack 2, a fixing plate 3, a soft gasket 4, a lower pressure head 5, an upper Indenter 6, grooved metal plate 7, quartz plate 8, silica gel heating sheet 9, wherein:
[0041] The upper and lower parts and the left and right parts of the integrated support 1 are an integral frame structure;
[0042] The bottom of the ...
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