Rotary type washing and drying apparatus

Abstract

The invention discloses a rotary type washing and drying apparatus. The rotary type washing and drying apparatus comprises a cavity unit, a wafer rotating unit, a washing unit, a drying unit and a static eliminating unit; the rotary type washing and drying apparatus is characterized in that the cavity unit is the body structure of the apparatus; the cavity unit is in a sealed state in the wafer process so as to keep the micro-environment state in the process; the wafer rotating unit is mounted in the interior of the cavity, and is driven by a motor to perform the rotating technological process; the washing unit, the drying unit and the static eliminating unit are mounted on the cavity unit and are used for performing steps of washing, drying and static eliminating on the wafer in the technological process; and the rotary type washing and drying apparatus is mainly used for performing the technological processes of washing, drying and the like on the wafer. The rotary type washing and drying apparatus has the beneficial effects that the wafer can be cleaned and dried in one time in the technological process on the wafer; the technological process is simple; the production efficiency of the equipment is improved; and the cost is low.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a rotary washing and drying device. Background technique [0002] Wafer cleaning and drying are essential process requirements in the production of semiconductor devices. Wafer cleaning is mainly used to remove particles such as organic matter, inorganic matter and metal residues in the process of the wafer. The drying of the wafer is mainly to dry the surface of the wafer after the cleaning of the wafer is completed, so as to avoid the secondary pollution of the wafer caused by the adsorption of tiny particles on the wet surface. In order to reduce the pollution caused by the external environment to the wafer as much as possible during the process, the industry generally adopts the "dry in and dry out" process method, that is, the wafer enters the process chamber in a dry state, and then remains in the process chamber. Out of the process chamber in a dry state. In t...

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Problems solved by technology

This method bears great disadvantages: First, the cleaning and drying process is carried out in separate chambers, so that the wet wafer after cleaning is in danger of being contaminated by the external environment during the transfer process, even with improved process methods such as Wafers are transferred in a closed environment with a higher cleanliness level, which can ensure that the wafers are not contaminated, but the maintenance of a higher cleanliness level environment will inevitably lead to an increase in operating costs; then, the cleaning and drying If the process is carried out separately, at least two process chambers will be required, which will inevitably increase the floor space of the equipment and also cause an increase in the overall cost of the equipment.

Due to the existence of the above-mentioned defects, when the prior art solution is adopted, the actual operation effect of the device is not ideal

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