Flexible conformal packaging structure

Abstract

The invention relates to a flexible conformal packaging structure, which comprises a plurality of chips, a flexible filling material, a flexible interconnection line layer and a protective layer, wherein the plurality of chips are packaged through the flexible filling material; one chip is packaged on the side of another chip; electric interconnection among the chips is achieved through surface wiring of the plurality of chips to form the flexible interconnection line layer; and the protective layer is arranged on the flexible interconnection line layer. Flexible conformal packaging can be achieved by the flexible filling material; the diversified requirements are met; fast interconnection of the chips is achieved by connection technologies of 3D printing and the like; the requirements on the mounting precision are reduced; the procedure is simplified; and the efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a flexible conformal packaging structure. Background technique [0002] With the continuous expansion of electronic system functions, the morphology of functional devices such as chip level and system level is becoming more and more diverse. At this time, conventional planar packaging can no longer meet the demand, which puts forward higher requirements for packaging capabilities. The demand for packaging is increasing, such as LED chips. Currently, the most widely used mode in LED light sources is single package, but its complex structure and long heat transfer channels make it difficult to dissipate heat, which leads to LED light efficiency and life expectancy. The performance is not ideal, so the development of integrated surface packaging mode has become a trend. In addition, wearable devices are becoming more and more popular at present. In order to meet ergonomics, ...

AI Technical Summary

Problems solved by technology

[0003] For the interconnection of the chip and the adapter board, the traditional method is to use the RDL method, but this method requires very high alignment accuracy of the chip and the adapter board, that is, high-precision placement is required, and because the plastic packaging material itself With the characteristics of temperature deformation, it is difficult to control the position of the device. The above reasons make the realization of RDL very difficult, and the resulting problems are low production efficiency and difficulty in ensuring reliability.

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