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Evaporation device and machining method for to-be-evaporated base plate

A technology of evaporation and substrate, which is applied in the field of production and manufacturing, can solve the problem of sagging of the substrate to be evaporated, and achieve the effect of preventing sagging

Inactive Publication Date: 2016-10-26
BOE TECH GRP CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides an evaporation device and a method for processing a substrate to be evaporated, which can effectively solve the problem of sagging of the substrate to be evaporated

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  • Evaporation device and machining method for to-be-evaporated base plate
  • Evaporation device and machining method for to-be-evaporated base plate

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Embodiment Construction

[0030] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0031] The present invention firstly provides a kind of vapor deposition device, with reference to figure 2 , including: an evaporation chamber, an evaporation source arranged in the evaporation chamber, a mask plate support frame and a substrate support base 204, wherein, since the evaporation chamber, the evaporation source, and the mask plate support frame belong to the existing technology, figure 2 Not shown in the figure; the mask plate support frame is used to carry the mask plate, the substrate support base is used to carry the substrate to be evaporated, and the mask plate is arranged on the evaporation source and the substrate to be evaporated Between 201. The evaporation device also includes: a second positioning mechanism 203 arranged in t...

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Abstract

The invention provides a to-be-evaporated base plate, an evaporation device and a machining method for the to-be-evaporated base plate. The to-be-evaporated base plate is provided with a first positioning mechanism detachably connected with the to-be-evaporated base plate. The first positioning mechanism is matched with a second positioning mechanism and can be connected and disconnected with the second positioning mechanism. In the evaporation process, the second positioning mechanism and the evaporation device are relatively fixed. The evaporation device comprises the second positioning mechanism arranged in an evaporation cavity, the second positioning mechanism corresponds to the first positioning mechanism on the to-be-evaporated base plate and is connected with the first positioning mechanism during evaporation, and accordingly the distance between the area provided with the first positioning mechanism and a base plate supporting base table is smaller than the second set value. The machining method for the evaporated base plate is used for machining the to-be-evaporated base plate provided by any embodiment. By means of the evaporation device and the machining method for the to-be-evaporated base plate, the problem of drooping of the to-be-evaporated base plate can be effectively solved.

Description

technical field [0001] The invention relates to the field of production and manufacturing, in particular to an evaporation device and a processing method for a substrate to be evaporated. Background technique [0002] Evaporation is a process often used in the manufacturing process of display products. It is to heat the material and make it adhere to the substrate in a vacuum environment. However, some factors affecting the yield rate in the evaporation process have not been well resolved so far, and the large amount of glass sagging is one of them. The evaporation process is a high vacuum environment and vacuum adsorption cannot be used, such as figure 1 As shown, the edge of the glass substrate 102 can only be supported by the support member (Finger) 101 at the upper end of the vapor deposition device, and the heavy weight of the glass substrate itself will cause a large amount of sagging. This is very detrimental to both the uniformity of evaporation and the alignment a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/04
CPCC23C14/042C23C14/24
Inventor 陈栋孔超梁逸南
Owner BOE TECH GRP CO LTD
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