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Package and packaging method, curing device, packaging system, display device

A curing device and packaging technology, which is applied in the direction of electrical components, electric solid devices, semiconductor devices, etc., can solve the problem of low service life of curved OLED devices, and achieve the effect of improving service life

Active Publication Date: 2018-04-03
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problem of low service life of curved OLED devices, the present invention provides a package, a package method, a curing device, a package system, and a display device

Method used

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  • Package and packaging method, curing device, packaging system, display device
  • Package and packaging method, curing device, packaging system, display device
  • Package and packaging method, curing device, packaging system, display device

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Embodiment Construction

[0080] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0081] Please refer to figure 1 , which shows an application scenario diagram of a package 00 provided by related technologies, see figure 1 , the package 00 includes: a first substrate 001 and a second substrate 002 , the coefficient of thermal expansion of the first substrate 001 is the same as that of the second substrate 002 . The second substrate 002 is provided with an encapsulation adhesive layer 003. When packaging the OLED device...

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Abstract

The invention discloses a package, a package method, a curing device, a package system and a display device, and belongs to the field of OLED device package. The package includes: a first substrate and a second substrate, both of the first substrate and the second substrate are curved substrates, and the bending direction of the first substrate is the same as that of the second substrate, and the first substrate and the second substrate are arranged in parallel, And between the first substrate and the second substrate, a device to be packaged and a packaging adhesive layer are formed, and the packaging adhesive layer is coated on the outside of the device to be packaged; the thermal expansion coefficient of the first substrate, the thermal expansion coefficient of the packaging adhesive layer and the thermal expansion of the second substrate The coefficients are all different. The invention solves the problem of low service life of the curved surface OLED device, and achieves the effect of improving the service life of the curved surface OLED device. The invention is used for OLED device packaging.

Description

technical field [0001] The invention relates to the field of OLED device packaging, in particular to a package, a package method, a curing device, a package system, and a display device. Background technique [0002] An organic light-emitting diode (English: Organic Light-Emitting Diode; abbreviation: OLED) device has the advantages of ultra-thinness, full viewing angle, and flexible display, and is widely used in the display field. However, the water vapor, oxygen and other components in the air will corrode the OLED device and affect the service life of the OLED device. Therefore, it is usually necessary to encapsulate the OLED device to isolate the OLED device from the water vapor and oxygen in the air, thereby prolonging the life of the OLED device. service life. [0003] OLED devices include curved OLED devices. When manufacturing curved OLED devices, the OLED device can be planarly packaged with a package first, and then the packaged OLED device can be bent using a cu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/841H10K71/00
Inventor 罗程远
Owner BOE TECH GRP CO LTD
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