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High efficiency heat radiation type host housing based on intelligent computer

A computer and heat dissipation technology, applied in the computer field, can solve the problems of poor heat dissipation, burnt chassis, blue screen, etc., to achieve the effect of convenient movement and handling, reduced maintenance costs, and simple structure

Inactive Publication Date: 2016-11-02
CHENGDU ZHONGFU LIXIANG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat dissipation efficiency of the traditional computer mainframe shell is low, which can easily cause the temperature of the electronic components in the chassis to be too high, causing crashes, blue screens, etc.
Not only affects the operating experience, but also greatly reduces the service life of the computer
The heat dissipation effect is poor due to the accumulation of a large amount of dust in the chassis, and the chassis is burned due to excessive temperature.

Method used

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  • High efficiency heat radiation type host housing based on intelligent computer
  • High efficiency heat radiation type host housing based on intelligent computer

Examples

Experimental program
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Effect test

Embodiment 1

[0017] Such as Figures 1 to 2 As shown, this embodiment provides a high-efficiency heat-dissipating mainframe housing based on an intelligent computer, including a main housing 1, a square groove 4 is provided on the upper end surface of the main housing 1, and a square groove 4 is provided at the opening of the square groove 4. There are two handles 5 parallel to each other, and the two handles 5 are detachably connected to the square groove 4. The upper front surface of the main housing 1 is provided with a groove area 3 for installing operation buttons, and the lower front surface of the main housing 1 A dust-proof plate groove 13 is provided, and a dust-proof cover A3-1 is provided on the outside of the groove area 3. The material of the dust-proof cover A3-1 is transparent plastic, and the upper part of the dust-proof cover A3-1 passes through the hinge mechanism 3- 2 is connected to the top of the groove area 3, a number of dust-proof plates 12 are horizontally hinged i...

Embodiment 2

[0019] Such as Figures 1 to 2 As shown, this embodiment provides a high-efficiency heat-dissipating mainframe housing based on an intelligent computer, including a main housing 1, a square groove 4 is provided on the upper end surface of the main housing 1, and a square groove 4 is provided at the opening of the square groove 4. There are two handles 5 parallel to each other, and the two handles 5 are detachably connected to the square groove 4. The upper front surface of the main housing 1 is provided with a groove area 3 for installing operation buttons, and the lower front surface of the main housing 1 A dust-proof plate groove 13 is provided, and a dust-proof cover A3-1 is provided on the outside of the groove area 3. The material of the dust-proof cover A3-1 is transparent plastic, and the upper part of the dust-proof cover A3-1 passes through the hinge mechanism 3- 2 is connected to the top of the groove area 3, a number of dust-proof plates 12 are horizontally hinged i...

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Abstract

The invention discloses a high efficiency heat radiation type host housing based on an intelligent computer, and relates to the computer technical field; the high efficiency heat radiation type host housing comprises a main housing; the top end face of the main housing is provided with a square groove; the opening of the square groove is provided with two parallel handles detachably connected with the square groove; the front end face of the main housing is provided with a groove zone used for mounting control buttons; a dustproof plate slot is arranged below the front end face of the main housing; a dustproof cover A is arranged outside the groove zone, and made of transparent plastic; the upper portion of the dustproof cover A is connected with the top of the groove zone through a hinge mechanism; a plurality of dustproof plates are transversely hinged in the dustproof plate slot; a mobile device is arranged below the main housing; the left end face or right end face of the main housing are provided with a heat radiation zone 1 and a heat radiation zone 2; the high efficiency heat radiation type host housing is simple in structure, and good in heat radiation dustproof effects.

Description

technical field [0001] The invention relates to the technical field of computers, and more specifically relates to an intelligent computer-based high-efficiency heat-dissipating host casing. Background technique [0002] At present, computers have become one of the necessary digital products for students and office workers. They can be used for office work, surfing the Internet and audio-visual entertainment, etc., greatly enriching people's spare time. However, the heat dissipation efficiency of the traditional computer mainframe shell is low, which can easily cause the temperature of the electronic components in the chassis to be too high, causing crashes, blue screens and other phenomena. It not only affects the operating experience, but also greatly reduces the service life of the computer. The heat dissipation effect is poor due to the accumulation of a large amount of dust in the chassis, and the chassis is burned due to excessive temperature. [0003] How to solve t...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 汪海李国
Owner CHENGDU ZHONGFU LIXIANG TECH
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