Thin type heat conduction device

Abstract

A thin type heat conduction device comprises a bottom plate and a cover plate which are combined in a planer superposition form. The bottom plate is provided with a level heat dissipation face. A press-fit edge is arranged on the periphery of the portion between the bottom plate and the cover plate. A vacuum cavity is formed within the surrounding range of the press-fit edge. A vacuumizing liquid injection opening is formed in a certain position of the press-fit edge and is sealed through a press-fit rim portion. The outer end of the press-fit rim portion is sealed through a welding process and is in a sealed state. The portion, corresponding to the press-fit edge, of the vacuumizing liquid injection opening is provided with an upward recessed face and is in a planar recessed state in the direction from the level heat dissipation face of the bottom plate to the cover plate. In this way, the outer end of the press-fit rim portion of the vacuumizing liquid injection opening is in an upward inward-contraction state relative to the level heat dissipation face of the bottom plate, so that welding flux for sealing has the downward protruding space, the welding flux is prevented from protruding out of the level heat dissipation face of the bottom plate, and the level heat dissipation face assembly levelness and the optimal heat dissipation efficiency of the bottom plate are guaranteed.

Description

technical field [0001] The invention relates to a heat conduction device; in particular, it refers to an innovative technology for the structural form of a thinned heat conduction device. Background technique [0002] In the application of heat conduction devices, the bottom plate is usually locked on a heat dissipation fin seat, and the cover plate surface of the heat conduction device is used to assemble a heat source (such as a CPU). A vacuum liquid injection port, the vacuum liquid injection port is used in the manufacturing process. After completing the work of vacuuming and injecting the working fluid, it must further form a closed edge shape through a stamping process, and the end of the vacuum liquid injection port It is usually further welded with solder to form a strong and tight end edge. [0003] However, the above-mentioned existing heat conduction device structure and manufacturing method still find some problems and disadvantages in the extensive application ...

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Problems solved by technology

[0003] However, the above-mentioned existing heat conduction device structure and manufacturing method still find some problems and disadvantages in the extensive application experience: for example, if the bottom plate and cover plate pressing edge of the heat conduction device adopt a thinner design, its total thickness is equivalent to Thin, usually no more than 0.5mm. Under the thin thickness condition, the edge of the solder welded at the end of the vacuum injection port usually protrudes from the upper and lower surfaces of the end of the vacuum injection port. The solder edge is protruding Even if the situation is not large, the negative impact and consequences are quite serious, because the lower surface of the bottom plate of the heat conduction device must be in a flat state, so as to ensure that the bottom plate and the heat dissipation fin seat are flat and tightly bonded, and the heat conduction is smooth and seamless. However, if the edge of the solder at the end of the vacuum injection port of the aforementioned existing heat conduction device protrudes outward, if the edge of the solder protrudes downward, it is equivalent to protruding outward in the direction of pressing the cover plate. In this state, even if the edge of the solder protrudes very slightly, it will still cause the base plate and the heat dissipation fin seat to be partially raised, so that it cannot achieve a flawed state of complete flatness and tightness, resulting in an average structure of the heat conduction device. The heat dissipated cannot be conducted to the heat dissipation fin seat for heat dissipation as expected, so it is necessary to think about a breakthrough

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