Manufacturing method of thin thermal conduction device

Abstract

A method for manufacturing a thinned heat conduction device, comprising preparing a base plate and a cover plate combined in a planar stacked form, the base plate has a flat heat dissipation surface, and there is a pressing edge between the base plate and the cover plate, the pressing A vacuum cavity is formed in the surrounding area of ​​the edge, and a vacuum liquid injection port is provided at one side of the pressing edge. The vacuum liquid injection port is closed by the pressing edge, and the outer end of the pressing edge is welded. The seal is tightly sealed; the position of the pressing edge corresponding to the vacuum injection port is provided with an upward inward concave surface, which is a planar inward concave shape from the flat heat dissipation surface of the bottom plate towards the cover plate; thereby, a vacuum is formed. The outer end of the pressing edge of the liquid injection port is retracted upwards relative to the flat heat dissipation surface of the bottom plate, so that the solder used for sealing has a space to protrude downward, preventing the solder from protruding outside the flat heat dissipation surface of the bottom plate. To ensure the flat heat dissipation surface assembly flatness of the bottom plate and the best heat dissipation performance.

Description

technical field [0001] The invention relates to a heat conduction device; in particular, it refers to an innovative technology of a manufacturing method of a thinned heat conduction device. Background technique [0002] In the application of heat conduction devices, the bottom plate is usually locked on a heat dissipation fin seat, and the cover plate surface of the heat conduction device is used to assemble a heat source (such as a CPU). A vacuum liquid injection port, the vacuum liquid injection port is used in the manufacturing process. After completing the work of vacuuming and injecting the working fluid, it must further form a closed edge shape through a stamping process, and the end of the vacuum liquid injection port It is usually further welded with solder to form a strong and tight end edge. [0003] However, the above-mentioned existing heat conduction device structure and manufacturing method still find some problems and disadvantages in the extensive applicatio...

AI Technical Summary

Problems solved by technology

[0003] However, the above-mentioned existing heat conduction device structure and manufacturing method still find some problems and disadvantages in the extensive application experience: for example, if the bottom plate and cover plate pressing edge of the heat conduction device adopt a thinner design, its total thickness is equivalent to Thin, usually no more than 0.5mm. Under the thin thickness condition, the edge of the solder welded at the end of the vacuum injection port usually protrudes from the upper and lower surfaces of the end of the vacuum injection port. The solder edge is protruding Even if the situation is not large, the negative impact and consequences are quite serious, because the lower surface of the bottom plate of the heat conduction device must be in a flat state, so as to ensure that the bottom plate and the heat dissipation fin seat are flat and tightly bonded, and the heat conduction is smooth and seamless. However, if the edge of the solder at the end of the vacuum injection port of the aforementioned existing heat conduction device protrudes outward, if the edge of the solder protrudes downward, it is equivalent to protruding outward in the direction of pressing the cover plate. In this state, even if the edge of the solder protrudes very slightly, it will still cause the base plate and the heat dissipation fin seat to be partially raised, so that it cannot achieve a flawed state of complete flatness and tightness, resulting in an average structure of the heat conduction device. The heat dissipated cannot be conducted to the heat dissipation fin seat for heat dissipation as expected, so it is necessary to think about a breakthrough

Images