Manufacturing method for thin type heat conduction device

Abstract

A manufacturing method for a thin type heat conduction device comprises the steps that a bottom plate and a cover plate which are combined in a face-shaped overlaid form are prepared, the bottom plate is provided with a flat heat dissipation face, a press-fit edge is arranged on the periphery of the part between the bottom plate and the cover plate, a vacuum cavity is formed within the surrounding range of the press-fit edge, a vacuum pumping liquid injection opening is formed in one position of the press-fit edge and sealed through a press-fit edge part, and the outer end of the press-fit edge part is sealed to be in a sealed state through a welding technology; the position, corresponding to the vacuum pumping liquid injection opening, of the press-fit edge is further provided with an upward inwards-concave face, and the upward inwards-concave face is in a face-shaped inwards-concave form in the direction from the flat heat dissipation face of the bottom plate to the cover plate; and accordingly, the outer end of the press-fit edge part forming the vacuum pumping liquid injection opening is in an upwards inwards-concave state relative to the flat heat dissipation face of the bottom plate, so that a space where welding flux used for sealing can protrude downwards is achieved, the welding flux is prevented from protruding out of the flat heat dissipation face of the bottom plate, and accordingly the assembling flatness degree and the optimal heat dissipation efficiency of the flat heat dissipation face of the bottom plate are ensured.

Description

technical field [0001] The invention relates to a heat conduction device; in particular, it refers to an innovative technology of a manufacturing method of a thinned heat conduction device. Background technique [0002] In the application of heat conduction devices, the bottom plate is usually locked on a heat dissipation fin seat, and the cover plate surface of the heat conduction device is used to assemble a heat source (such as a CPU). A vacuum liquid injection port, the vacuum liquid injection port is used in the manufacturing process. After completing the work of vacuuming and injecting the working fluid, it must further form a closed edge shape through a stamping process, and the end of the vacuum liquid injection port It is usually further welded with solder to form a strong and tight end edge. [0003] However, the above-mentioned existing heat conduction device structure and manufacturing method still find some problems and disadvantages in the extensive applicatio...

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Problems solved by technology

[0003] However, the above-mentioned existing heat conduction device structure and manufacturing method still find some problems and disadvantages in the extensive application experience: for example, if the bottom plate and cover plate pressing edge of the heat conduction device adopt a thinner design, its total thickness is equivalent to Thin, usually no more than 0.5mm. Under the thin thickness condition, the edge of the solder welded at the end of the vacuum injection port usually protrudes from the upper and lower surfaces of the end of the vacuum injection port. The solder edge is protruding Even if the situation is not large, the negative impact and consequences are quite serious, because the lower surface of the bottom plate of the heat conduction device must be in a flat state, so as to ensure that the bottom plate and the heat dissipation fin seat are flat and tightly bonded, and the heat conduction is smooth and seamless. However, if the edge of the solder at the end of the vacuum injection port of the aforementioned existing heat conduction device protrudes outward, if the edge of the solder protrudes downward, it is equivalent to protruding outward in the direction of pressing the cover plate. In this state, even if the edge of the solder protrudes very slightly, it will still cause the base plate and the heat dissipation fin seat to be partially raised, so that it cannot achieve a flawed state of complete flatness and tightness, resulting in an average structure of the heat conduction device. The heat dissipated cannot be conducted to the heat dissipation fin seat for heat dissipation as expected, so it is necessary to think about a breakthrough

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