A dust-proof and heat-dissipating computer case

Abstract

The invention discloses a dustproof cooling computer case and mainly relates to the technical field of computers. The dustproof cooling computer case comprises a case body. The bottom of the case body is provided with a driving motor. The inner wall of the case body is provided with a rotating shaft. The rotating shaft is provided with a connection plate. One end of the connection plate is provided with a baffle. The connection plate is provided with a supporting plate. The end, close to the baffle, of the supporting plate is provided with a supporting base. The side, away from the supporting plate, of the supporting base is provided with a supporting rod. The supporting rod is provided with a spring. The supporting plate is provided with a brush. The bottom of the case body is provided with a dust collection box. A dust collector fan is arranged in the dust collection box. The top of the case body is provided with a refrigeration box. The dustproof cooling computer case has the advantages that the case can be efficiently cooled, the interior of the case body can be cleaned as needed at any time, dust can be prevented from being heavily accumulated on electronic elements in the case body, and the service life of the electronic elements in the case body can be ensured.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a dust-proof and heat-dissipating computer case. Background technique [0002] There are a large number of electronic components in the computer case, which will generate a lot of heat during operation. During use, the computer is often unstable or even burned out due to overheating of the case. At present, most existing computers use cooling fans to dissipate heat from the case, and the heat dissipation effect is greatly affected by the external environment temperature. When the external environment temperature is high, the heat dissipation efficiency is extremely low. Most of the chassis are non-enclosed chassis. During use, a large amount of dust inevitably accumulates on the electronic components in the chassis. The large accumulation of dust seriously affects the heat dissipation of the electronic components, resulting in a reduction in the service life of the electronic c...

AI Technical Summary

Problems solved by technology

[0002] There are a large number of electronic components in the computer case, which will generate a lot of heat during operation. During use, the computer is often unstable or even burned out due to overheating of the case.

At present, most existing computers use cooling fans to dissipate heat from the case, and the heat dissipation effect is greatly affected by the external environment temperature. When the external environment temperature is high, the heat dissipation efficiency is extremely low. Most of the chassis are non-enclosed chassis. During use, a large amount of dust inevitably accumulates on the electronic components in the chassis. The large accumulation of dust seriously affects the heat dissipation of the electronic components, resulting in a reduction in the service life of the electronic components in the chassis. However, the existing chassis is inconvenient to clean, and the chassis cannot be cleaned at any time as required.

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