Additive for chambering acid liquid for texturing polycrystal black silicon and application of additive

Abstract

The invention provides an additive for chambering acid liquid for texturing polycrystal black silicon. The additive comprises the following components in percentage by mass: 0.5%-2% of polyvinyl alcohol, 1%-5% of triethanolamine, 1%-3% of tartaric acid, 0.5%-2% of a silane coupling agent and the balance of water. The invention further provides the chambering acid liquid adopting the additive and a method for texturing polycrystal black silicon. By adding the additive into the chambering acid liquid, the reaction of the chambering treatment can be decelerated, and the reaction rates of the chambering acid liquid on crystal surfaces of the polycrystal black silicon can be furthest kept consistent, so that the anisotropic corrosion is inhibited, crystal patterns of the polycrystal black silicon are obviously improved, and the appearance superiority and the performance superiority of the black silicon are embodied.

Description

technical field [0001] The invention relates to an additive for hole-expanding acid liquid for making texture of polycrystalline black silicon and its application. Background technique [0002] At present, in the polycrystalline black silicon texturing process, the method of metal-assisted wet chemical etching is more and more widely used, and the method of metal-assisted wet chemical etching can prepare polycrystalline black silicon with nano-holes . [0003] Metal-assisted wet chemical etching generally uses metal ions. Since the metal particles are relatively small, only a few nanometers to tens of nanometers, the corresponding nanopores formed on polycrystalline black silicon have a pore size of only a few nanometers to tens of nanometers. In order to increase the coverage of the textured surface, reduce the recombination of the silicon wafer surface, and improve the electrical performance of the cell, it is necessary to expand the polycrystalline black silicon obtained...

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Problems solved by technology

[0004] Hole reaming treatment generally adopts reaming acid solution, currently commonly used reaming acid solution is a single-component acid solution or a mixture of several acids (such as a mixture of nitric acid and hydrofluoric acid), although these pore reaming acid solutions can To a certain extent, the purpose of hole expansion is achieved, but the reaction of hole expansion treatment is too fast and difficult to control, which affects the uniformity of the nano suede surface; at the same time, the anisotropic corrosion of the hole expansion acid will make the surface of black silicon serious, Seriously affected the appearance of polycrystalline black silicon, greatly reducing the user's recognition of black silicon texture

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