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System-grade packaged chip, preparation method thereof and equipment comprising system-grade packaged chip

A system-in-package, chip technology, applied in the field of microelectronics, which can solve problems such as difficulty in meeting the needs of the Internet of Things

Inactive Publication Date: 2016-11-16
MIDEA SMART TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, with the continuous demand of the Internet of Things for chips in all aspects of their performance, figure 1 The SiP modules shown are increasingly difficult to meet the needs of the Internet of Things

Method used

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  • System-grade packaged chip, preparation method thereof and equipment comprising system-grade packaged chip
  • System-grade packaged chip, preparation method thereof and equipment comprising system-grade packaged chip
  • System-grade packaged chip, preparation method thereof and equipment comprising system-grade packaged chip

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Embodiment Construction

[0046] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0047] figure 2 A block diagram of a SiP module provided for an embodiment of the present invention. like figure 2 As shown, the SiP module provided by an embodiment of the present invention includes: a microcontroller processing unit (Mirco Controller Unit; MCU) 200; The electrical signal is sent to the processing unit by the microcontroller.

[0048] The infrared sensor can be a pyroelectric infrared sensor, and the pyroelectric infrared sensor includes an optical system, a detection element and a conversion circuit. Pyroelectric infrared sensors are temperature sensitive sensors. It is composed of ceramic oxide or piezoelectric crystal elements, and el...

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Abstract

The invention relates to the field of microelectronics, and discloses a system-grade packaged chip, equipment comprising the system-grade packaged chip, and a preparation method of the system-grade packaged chip. The system-grade packaged chip comprises the components of a microcontroller processing unit; and an infrared sensor which is used for generating an electric signal that reflects whether human body or animal activity exists and transmitting the electric signal to the microcontroller processing unit. According to the system-grade packaged chip, through packaging the infrared sensor in the system-grade packaged chip, the system-grade packaged chip can detect activity of the human body or the animal and furthermore performs corresponding controlling according to a detection result.

Description

technical field [0001] The invention relates to the field of microelectronics, in particular to a system-in-package chip, a device containing the system-in-package chip, and a preparation method of the system-in-package chip. Background technique [0002] The Internet of Things (Internet of Things) is an important part of the new generation of information technology, and the Internet of Things is the Internet where things are connected. It uses communication technologies such as local networks or the Internet to connect sensors, controllers, machines, people and things together in a new way, forming a connection between people and things, things and things, and realizing informatization, remote management control and intelligence. network of. It is a ubiquitous network built on the Internet. The important foundation and core of the Internet of Things technology is still the Internet. Through the integration of various wired and wireless networks and the Internet, the infor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/18H01L21/60H04B1/40H04W88/06
CPCH01L24/83H01L24/85H01L24/92H01L25/18H01L2224/83024H01L2224/83815H01L2224/85801H01L2224/92147H04B1/40H04W88/06
Inventor 梁海浪
Owner MIDEA SMART TECH CO LTD
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