Direct-cooling type refrigeration equipment

Abstract

The invention provides direct-cooling type refrigeration equipment. The direct-cooling type refrigeration equipment comprises a thermal insulating box and a door body and further comprises an upper semiconductor refrigeration module located on the upper portion of the thermal insulating box. The upper semiconductor refrigeration module comprises an upper semiconductor refrigeration slice, an air duct, an upper fan, an upper radiator and a baffle. A cooling fin set is arranged on the upper radiator and comprises multiple cooling fins. The front end face of the cooling fin set is covered with the upper fan. The cooling fin set is located between the baffle and the air duct. The end face of one side of the cooling fin set is covered with the baffle. The end face of the other side of the cooling fin set is covered with the air duct. An air groove is formed between every two adjacent cooling fins. The air grooves communicate with the air duct. The upper fan, the air grooves and the air duct form a cooling air flow path. The hot end of the upper semiconductor refrigeration slice is connected with the upper radiator in a heat conducting manner. A heat conducting inner container is arranged in the thermal insulating box. The cold end of the upper semiconductor refrigeration slice is connected with the upper portion of the thermal conduction inner container in a heat conducting manner. By the adoption of the direct-cooling type refrigeration equipment, the running noise and the energy consumption of the direct-cooling type refrigeration equipment are reduced.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a direct cooling refrigeration equipment. Background technique [0002] At present, in fast food restaurants, it is usually necessary to refrigerate some beverages or liquid milk products, and the refrigeration equipment in the prior art usually uses a compressor for refrigeration, but this will cause the volume of the refrigeration equipment to be too large, while the refrigeration equipment in the prior art In order to meet the requirements of small volume, semiconductor cooling chips are usually used for cooling. Usually, multiple semiconductor cooling chips are installed on the back of the insulation box. In order to achieve uniform cooling temperature in the insulation box, fans are usually used to cool the semiconductor refrigeration. The cold energy generated by the fins is sent into the insulated box. However, in the actual use process, the fan will generate noise and consume a l...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a direct-cooling refrigeration equipment, which solves the defects of high noise and high energy consumption of the direct-cooling refrigeration equipment in the prior art, and realizes reducing the operating speed of the direct-cooling refrigeration equipment. Noise and reduced energy consumption

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