Chip electronic component and manufacturing method thereof
An electronic component and chip technology, applied in the manufacture of inductors/transformers/magnets, coils, electrical components, etc., can solve problems such as difficult to achieve capacity or DC Rdc characteristics, slow growth of plating layer, insufficient copper ions, etc.
Active Publication Date: 2018-08-28
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
[0010] Furthermore, since the outermost plating layer and the innermost plating layer do not have an adjacent plating layer on one side and a barrier such as solder resist (SR) or dry film resist (DFR) is provided, The supply of copper ions will be insufficient, therefore, the plating layer grows slowly in the thickness direction, resulting in uneven plating thickness distribution of the entire coil conductor pattern
[0011] It is difficult to achieve the designed capacity or achieve DC Rdc characteristics due to the distribution of plating thickness above
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[0030] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
[0031] However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0032] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.
[0033] chip electronic components
[0034] Hereinafter, a chip type electronic component according to an exemplary embodiment of the present disclosure will be described particularly for a thin film type inductor, but is not limited thereto.
[0035] figure 1 is a schematic perspective view showing an inner coil pattern of a chip type e...
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Abstract
A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.
Description
[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2015-0069721 filed with the Korean Intellectual Property Office on May 19, 2015, the entire disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip type electronic component and a board for mounting the chip type electronic component. Background technique [0003] An inductor is a chip electronic component and is a representative passive device that can be constructed as a component in an electronic circuit along with a resistor and a capacitor to remove noise from the electronic circuit. In addition, the inductor can be used to configure a resonance circuit for amplifying a signal within a specific frequency band by combining with a capacitor utilizing electromagnetic properties, a filter circuit, and the like. [0004] Recently, the trend of miniaturization and thinning of information technology (IT) devices, such a...
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IPC IPC(8): H01F17/00H01F27/28H01F41/04
CPCH01F17/0006H01F27/2804H01F41/041H01F2017/0073H01F2027/2809H01F17/0013H01F17/04H01F27/292H01F41/042H01F41/046H01F2017/048
Inventor 郑汀爀灸寿房惠民朴明俊崔云喆
Owner SAMSUNG ELECTRO MECHANICS CO LTD