Loudspeaker and terminal
A technology for loudspeakers and recessed parts, applied in the direction of sensors, electrical components, etc., can solve the problems of increasing the thickness of the loudspeaker and the volume occupied by the hearing aid coil, and achieve the effect of reducing the thickness
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Embodiment 1
[0023] This embodiment provides a speaker, and the speaker can be applied to a terminal, where the terminal can be a smart phone, a tablet computer, or other devices.
[0024] Dynamic speakers are widely used in terminals to convert audio electrical signals generated by the terminal into sound wave signals, thereby generating sound. The core part of the dynamic speaker is the voice coil and diaphragm. The voice coil is placed in a magnetic field. When the audio electrical signal generated in the terminal flows through the voice coil, the voice coil will vibrate under the action of magnetic field force (ie Lorentz force) in the magnetic field. The diaphragm connected to the voice coil then vibrates, and drives the air around the diaphragm to vibrate, thereby producing sound.
[0025] refer to figure 1 , figure 1 Shown is a cross-sectional view of the speaker provided by the embodiment of the present invention.
[0026] The loudspeaker 10 includes a bracket 11 , an upper co...
Embodiment 2
[0042] This embodiment provides a speaker, and the speaker can be applied to a terminal, where the terminal can be a smart phone, a tablet computer, or other devices.
[0043] refer to Figure 4 , Figure 4 Shown is a cross-sectional view of the speaker provided by the embodiment of the present invention.
[0044] The loudspeaker 20 includes a bracket 21 , an upper cover 22 , a hearing aid coil 23 , a fixed layer 24 , a magnetically conductive plate 25 , a magnetic steel 26 , a magnetically conductive sheet 27 , a voice coil 28 and a diaphragm 29 .
[0045] Wherein, the upper cover 22 is installed on the bracket 21 . In a specific application, the upper cover 22 may be fixed on the bracket 21 by bonding. The bracket 21 can be integrally formed by injection molding. The upper cover 22 can also be integrally formed by injection molding. In a preferred embodiment, the bracket 21 and the upper cover 22 are made of nanomaterials. Both the bracket 21 and the upper cover 22 are...
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