Pseudo soldering examining and judging method for BGA and CSP type chip spherical welding spots

A spherical and chip technology, applied in the direction of measuring devices, instruments, measuring electronics, etc., can solve the problems that the center of the upper and lower pads of the solder joints cannot be completely aligned, the design and manufacturing time and cost are high, and the spherical solder joints cannot be accurately distinguished, etc., to achieve Avoid irreversible destructive, high cost, and high judgment accuracy effects

Active Publication Date: 2016-12-14
国营芜湖机械厂
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Problems solved by technology

There are three disadvantages of this method: one is that it is impossible to accurately distinguish the three situations of spherical solder joints, chip pads and PCB pads that are not soldered, partially soldered, and completely soldered; The position of the pad is designed separately for each chip, th

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  • Pseudo soldering examining and judging method for BGA and CSP type chip spherical welding spots
  • Pseudo soldering examining and judging method for BGA and CSP type chip spherical welding spots
  • Pseudo soldering examining and judging method for BGA and CSP type chip spherical welding spots

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Embodiment Construction

[0029] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with the embodiments.

[0030] The method for inspecting the virtual solder joints of BGA and CSP chip spherical solder joints comprises the following steps:

[0031] (1) Prepare an X-ray fluoroscopy inspection equipment with oblique irradiation function. Shimadzu SMX-1000PLUS micro-focus X-ray fluoroscopy device can be used. The maximum tube voltage of this equipment is 90KV, the maximum tube current is 110μA, and the resolution is 5μm. The magnification is 7-161 times, and the tilt angle range is between 0-60°;

[0032] (2) Open the equipment door and put the circuit board to be inspected on the equipment stage; open the radiation generating device, and move the part to be inspected under the radiation;

[0033] (3) Set the device parameters as follows: the tube volt...

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Abstract

The invention relates to a pseudo soldering examining and judging method for BGA and CSP type chip spherical welding spots. The examining method comprises steps of: preparing an X-ray fluoroscopic examination device with an inclination irradiation function; opening a device door and putting a to-be-examined circuit board on a device carrier table; opening a ray generation device and moving a to-be-examined part to the ray; setting the device parameters as follows: the tube voltage to be 90KV; the tube current to be 110[mu]A; the filter to be high pass filter 1; the gamma value to be kept unchanged as 1; the brightness to be 3296; the contrast ratio to be 1447; and the angle of inclination to be adjusted to be 30 degrees; after the target is found, adjusting the magnification times to be the maximum; and under the inclined X-ray radiation, differentiating an upper-lower welding disc imaging profile and a welding ball body imaging profile. According to the invention, irreversible destructiveness caused by cross-section and electron microscopic energy spectrum methods is avoided; a pseudo soldering function of nondestructive examination for BGA and CSP type chip spherical welding spots is added; the pseudo soldering examining and judging method is simple to operate; and the judgment accuracy is high.

Description

technical field [0001] The invention relates to the technical field of solder joint quality detection, in particular to a method for checking and judging virtual solder joints of spherical solder joints of BGA and CSP chips. Background technique [0002] The solder joints of BGA and CSP chips are spherical array solder joints, which are located at the bottom of the chip. Visual inspection tools / equipment such as microscopes can only check the four rows of spherical solder joints on the four sides of the chip. At present, whether the solder ball joints of BGA and CSP chips are completely virtual can only be checked by metallographic section and electron microscope energy spectrum. Dot checks are destructive. In addition, the existing X-ray inspection equipment can observe all spherical solder joints through X-ray perspective. In the patent application number ZL200410048243.9, a method of "using X-ray inspection of printed components to improve the detection of defective sold...

Claims

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Application Information

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IPC IPC(8): G01R31/04
CPCG01R31/70
Inventor 刘姚军阚艳高怀亮
Owner 国营芜湖机械厂
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