Improved heat dissipative integrated circuit package

Abstract

The invention discloses an improved heat dissipative integrated circuit package, comprising a substrate, wherein strip bosses are formed on two sides of the substrate, concave platforms are formed on the inner sides of the bosses, the bottoms of the concave platforms are fixedly connected with a plurality of contacts, the contacts are electrically connected with pins by leads, chips are arranged in the concave platforms on the contacts, and a plurality of heat conducting ceramic columns are inserted into the upper end face of the substrate; guide rail slots are formed in the outer walls of the bosses, a closing cover is inserted into the guide rail slots, the closing cover comprises a cover plate and an L-shaped support inserted into the guide rail slots, a plurality of heat dissipation channels are formed on the cover plate, the L-shaped support comprises a vertical part and a horizontal part inserted into the guide rail slots, the horizontal part of the L-shaped support on one side of the substrate is screwed to a rotating screw, the rotating screw is located in the guide rail slots and one end of the rotating screw stretches out of the guide rail slots. The package facilitates packaging, and can realize quick heat dissipation and prolong the service life of an integrated circuit.

Description

Technical field: [0001] The invention relates to the technical field of integrated circuits, in particular to an improved heat dissipation integrated circuit package. Background technique: [0002] The electronics industry continues to reduce the size of electronic components and continue to increase functions on electronic components, which makes the functions and complexity of integrated circuits continue to increase. This trend also drives the packaging technology of integrated circuit components to develop in the direction of small size, high pin count and high electrical / thermal performance, and conforms to predetermined industrial standards. Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to facilitate heat dissipation and prolong the service life of int...

AI Technical Summary

Problems solved by technology

Since high-performance integrated circuit components generate higher heat, and the current small package technology only provides designers with a small heat dissipation mechanism, it is necessary to design a heat dissipation structure on its small package structure to facilitate heat dissipation and prolong the service life of integrated circuits , the heat dissipation effect of the heat dissipation structure on the existing small package structure is not ideal

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