Method for judging defects of flash memory plastic packaging device based on acoustic scanning

A method for judging defects and a technology for defect determination, applied in scientific instruments, instruments, material analysis using sonic/ultrasonic/infrasonic waves, etc., can solve the problems of cumbersome operation, repeated acoustic scanning detection steps, etc., and achieve the effect of improving efficiency

Active Publication Date: 2016-12-21
天航长鹰(江苏)科技有限公司
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[0006] The purpose of the present invention is to provide a method for judging defects of plastic-encapsulated devices based on aco

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  • Method for judging defects of flash memory plastic packaging device based on acoustic scanning

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Embodiment Construction

[0027] The flash memory plastic packaging device selected in the present invention is the EPCS16SI16N model of Altera Company. EPCS16SI16N is a flat-package plastic device, with a total of 50 samples, and the samples are numbered. In combination with specific actual cases, a method for judging defects of flash memory plastic packaging devices based on acoustic scanning described in the present invention will be described in detail.

[0028] A method for judging defects of flash memory plastic packaged devices based on acoustic scanning in the present invention, the flow chart of which is as follows figure 1 As shown, the specific implementation steps are as follows:

[0029] Step 1: C-scan layer by layer. Layer-by-layer C-scanning is to check whether there are cracks or voids in the plastic package. Because interface delamination only occurs at the junction of different parts inside the device, it is impossible to have interface delamination inside the plastic package. Ther...

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Abstract

A method for judging defects of a plastic packaging device based on acoustic scanning comprises seven steps: one, carrying out layer-by-layer C scanning on the device; two, judging whether a C scanned image of each layer has a bright region; three, judging whether the C scanned image of each layer has a black line segment; four, focusing a transducer on a lead frame, and carrying out C scanning; five, judging whether the C scanned images have a bright region; six, judging whether the C scanned images have a black coast line; and seven, overturning the device, making the bottom of the device upward, and repeating the step four, the step five and the step six. The acoustic scanning detection of the plastic packaging device is divided into two parts, namely plastic packaging body detection and important interface detection. Not only are test items provided, but also a method for judging voids, cracks and interface delamination defects is provided. The method can improve the efficiency of acoustic scanning detection, and has a certain guiding significance on acoustic scanning detection of the flash memory plastic packaging device.

Description

(1) Technical field: [0001] The invention relates to a method for detecting defects of electronic components, in particular to a method for determining defects of plastic-encapsulated flash memory devices based on acoustic scanning, and belongs to the field of defect detection for electronic components. (2) Background technology [0002] Plastic-encapsulated devices have low unit cost, small size, light weight, and can be mass-produced, and their vibration and shock resistance performance is significantly better than that of cavity devices, and there is no redundant problem, which makes them more applicable and has broad market application prospects . Due to the inherent material and structural characteristics of plastic-encapsulated devices, there are inevitably some potential defects, which will directly affect the long-term reliability of the device. As a non-hermetic package, the main disadvantage of plastic packaging is that it is sensitive to humid environments. Defe...

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Application Information

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IPC IPC(8): G01N29/265
CPCG01N29/265G01N2291/0235G01N2291/0289G01N2291/263
Inventor 黄姣英杨达明熊园园高成
Owner 天航长鹰(江苏)科技有限公司
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