A Defect Judgment Method for Flash Plastic Packaging Devices Based on Acoustic Scanning
A judging method and defect technology, applied to scientific instruments, instruments, material analysis using sound waves/ultrasonic waves/infrasonic waves, etc., can solve problems such as cumbersome operations, repeated steps of acoustic scanning detection, etc., and achieve the effect of improving efficiency
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[0027] The flash memory plastic packaging device selected in the present invention is the EPCS16SI16N model of Altera Company. EPCS16SI16N is a flat-package plastic device, with a total of 50 samples, and the samples are numbered. In combination with specific actual cases, a method for judging defects of flash memory plastic packaging devices based on acoustic scanning described in the present invention will be described in detail.
[0028] A method for judging defects of flash memory plastic packaged devices based on acoustic scanning in the present invention, the flow chart of which is as follows figure 1 As shown, the specific implementation steps are as follows:
[0029] Step 1: C-scan layer by layer. Layer-by-layer C-scanning is to check whether there are cracks or voids in the plastic package. Because interface delamination only occurs at the junction of different parts inside the device, it is impossible to have interface delamination inside the plastic package. Ther...
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