Method for making contact with a component embedded in a printed circuit board
A technology for printed circuit boards and components, which is applied in the direction of printed circuits, circuits, and electrical components connected to non-printed electrical components, and can solve problems such as delamination.
Inactive Publication Date: 2016-12-21
AT & S AUSTRIA TECH & SYSTTECHN AG
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Problems solved by technology
This known method and the resulting products have the disadvantage that cavities are left in the spacer region between the wafer and the adjoining layers, which can lead to delamination problems during lay-up of additional layers
Method used
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Embodiment Construction
[0027] The method according to the invention and the printed circuit board of the invention will now be explained with reference to the drawings. In this description, the term "core" as used in the context of this representative description below is understood to mean a cured prepreg which has a conductor layer (copper layer) on at least one surface.
[0028] figure 1 A cross-section of a core 1 is shown, comprising an insulating layer 2 , for example of prepreg material commonly used in the printed circuit board industry, such as FR 4 , and also an upper conductor layer 3 and a lower conductor layer 4 . It should be noted here that the words "up" and "down" merely represent directions in the diagram and are used for simplification of explanation. The thickness of the layers is, for example, one hundred micrometers for the insulating layer 2, one to five micrometers for the upper conductor layer 3 and the lower conductor layer 4, generally 2 micrometers.
[0029] A recess 5 ...
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The invention relates to a method for making contact with a component (6) embedded in a printed circuit board (13), which method has the following steps: a) providing a core (1) which has at least one insulating layer (2) and at least one conductor layer (3, 4) applied to the insulating layer (2), b) embedding at least one component (6) in a depression (5) in the insulating layer (2), wherein the contact pins (8) of the component (6) are located substantially in the plane of an outer surface of the core (1) having the at least one conductor layer (4), c) applying a varnish (9) that can be photo-structured to the one outer surface of the core (1) on which the component (6) is arranged, filling the spaces between the contact pins (8) of the component (6), d) exposing end faces of the contact pins (8) and the regions of the conductor layer (4) covered by the varnish (9) that can be photo-structured, by illuminating and developing the varnish (9) that can be photo-structured, e) by applying a semi-additive process, depositing a layer (10) of conductor material on the exposed end faces of the contact pins (8) and the exposed regions of the conductor layer (4), and forming a conductor structure (12-12), at least on the one outer surface of the core (1) on which the component (6) is arranged, and on the connecting lines (11) between the contact pins (8) and the conductor structure (12-12), and f) removing the regions of the conductor layer (4+10) that do not belong to the conductor structure (12-12).
Description
technical field [0001] The invention relates to a method for joining components embedded in printed circuit boards. [0002] The invention also relates to a printed circuit board having at least one insulating layer and at least one structured conductor layer with conductor paths and at least one component which is embedded with an adhesive layer into a recess of the printed circuit board, the contacts of which It lies substantially in the plane of the printed circuit board showing the outer surface of the at least one conductor layer and has an electrically conductive connection between the contacts of the component and the conductor paths of the conductor layer. Background technique [0003] Professionals are very familiar with embedding components, especially semiconductor chips, in printed circuit board structures, wherein within the scope of the present invention, the structure studied is that the contacts of the components are substantially located on a plane on the ou...
Claims
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IPC IPC(8): H01L23/13H01L23/538H05K1/18H05K3/10
CPCH01L21/56H01L23/3135H01L23/485H01L23/5389H01L24/96H05K1/188H05K3/4602H01L2224/215H01L2224/73265H01L2924/18162H01L23/13H01L2224/18H05K2201/10674H05K3/108H01L24/19H01L24/20H01L2224/04105H01L2224/24227H01L2224/32225H01L2224/73267H01L2224/92244H01L2924/15153H01L2224/2919H01L2224/83874H05K3/064H05K3/30
Inventor 吉罗德·温蒂妮格安德烈亚斯·斯洛克
Owner AT & S AUSTRIA TECH & SYSTTECHN AG