Resin composition for permanent insulating film, the permanent insulating film, multilayer printed circuit board, and manufacturing method therefor
A resin composition and multi-layer printing technology, which is applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as hindering signal transmission maintainability, unwanted conductor circuit layers, etc., to achieve suppression of adverse effects, Excellent effect of plating solution resistance
Active Publication Date: 2016-12-21
TAIYO HLDG CO LTD
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] When the entire through-hole is plated in this way, if there is a portion where the electrical connection between the conductor circuit layers is not desired, there is a concern that this portion will be plated with a conductive substance, thereby hindering the maintainability of signal transmission.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1～8、 comparative example 1～3
[0108] (Preparation of resin composition for permanent insulating film)
[0109] According to the following Table 1, each component was kneaded with the 3-roll mill, and the resin composition of Examples 1-8 and Comparative Examples 1-3 were obtained. The numbers in the table represent parts by mass.
[0110] [Table 1]
[0111]
[0112] *1 jER828 manufactured by Mitsubishi Chemical Corporation
[0113] *2 90% carbitol acetate solution of DEN438 manufactured by Dow Chemical Company
[0114] *3 60% carbitol acetate solution of HF-1M manufactured by Meiwa Kasei Co., Ltd.
[0115] *4 40% carbitol solution of Joncryl 678 molecular weight 8500 styrene-acrylic resin (acid value 215mg / gKOH) manufactured by BASF CORPORATION
[0116] *5 Luberon L-5 manufactured by DAIKIN INDUSTRIES, LTD. has an average particle size of 5 μm
[0117] *6 TF-9205 manufactured by 3M Japan Limited has an average particle size of 8 μm
[0118] *7 KMP-590 manufactured by Shin-Etsu Chemical Co., Ltd. w...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
Provided is a resin composition for a permanent insulating film in which catalytic species (seeds) are not deposited on plating resist areas, and partial through-holes, particularly through-holes that are divided, can easily and precisely be formed as designed. The resin composition for a permanent insulating film is characterized by containing a thermosetting resin, a resin filler, and a compound containing sulfur atoms and / or nitrogen atoms. Further provided is a multilayer printed circuit board in which circuit patterned conductor layers and insulating layers are alternately laminated, the conductor layers conducting current via a through hole. The multilayer printed circuit board is characterized in that: the through-hole comprises a plating resist section, which is provided to an interlayer between a conductor layer and an insulating layer exposed at the through-hole opening, and / or an interlayer between insulating layers, and a plating section formed in an exposed region other than the plating resist section; and the plating resist section is formed from the cured product of the resin composition.
Description
technical field [0001] The present invention relates to a resin composition for a permanent insulating film, a permanent insulating film (plating resist) formed from its cured product, a multilayer printed circuit board manufactured using the same, and a method for manufacturing the same, in particular to a part having a through hole. A multilayer printed circuit board with partially through-holes formed by dividing the through-holes by the plating resist. Background technique [0002] Generally, in a printed circuit board, a patterned conductor circuit for connecting components is formed on the surface or inner layer of the circuit board based on the circuit design, and electronic components are mounted on the surface with solder. In recent years, due to miniaturization of electronic devices such as mobile phones, portable electronic terminals, and computers, densification of printed circuit boards used in these electronic devices has been demanded. [0003] On the other h...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K3/46
CPCH05K1/0373H05K3/184H05K3/4602H05K2201/0212H05K2201/0236H05K3/429H05K3/46H05K1/0298H05K1/0353H05K1/115H05K3/0047
Inventor 椎名桃子峰岸昌司
Owner TAIYO HLDG CO LTD